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KAT-1-D Arkusz danych(PDF) 2 Page - Mini-Circuits |
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KAT-1-D Arkusz danych(HTML) 2 Page - Mini-Circuits |
2 / 4 page Millimeter Wave Precision Fixed Attenuator Die Page 2 of 4 Notes A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document. B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp Mini-Circuits® www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com KAT-1-D+ Product Features • Wide bandwidth, DC to 43.5 GHz • Excellent attenuation accuracy & flatness • Exceptional power handling, up to 2W REV. A M164399 KAT-1-D+ RS/CP/AM 171017 Typical Applications • Cellular • PCS • Communications • Radar • Defense • 5G 50Ω 2W 1dB DC to 43.5 GHz +RoHS Compliant The +Suffix identifies RoHS Compliance. See our web site for RoHS Compliance methodologies and qualifications General Description KAT-1-D+ is an absorptive attenuator Die fabricated using highly repetitive MMIC process including thin film resistors on GaAs substrate. KAT-1-D+ attenuator Die contains through-wafer vias to realize low thermal resistance and wideband operation. Simplified Schematic Ordering Information: Refer to Last Page Bonding Pad Position / Description Pad # Description 2 RF-IN 5 RF-OUT 1,3,4,6 Ground Die bottom Ground (Numbers on bond pads are for identification only, not marked on Die) H3 0 L1 L2 L3 L4 0 H1 H2 1 2 3 6 5 4 Die dimensions in µm L1 L2 L3 L4 H1 H2 H3 Thickness Bond pad size 100 340 580 750 85 615 700 100 125 x 100 Note: 1. Bond Pad material - Gold 2. Bottom of Die - Gold plated |
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