GS

2AFL

THRU

GS

2MFL

2.0 Amp Glass

Passivated Rectifier

50 to 1000 Volts

Maximum Ratings

•

Operating Temperature: -55

°C to +150°C

•

Storage Temperature: -55

°C to +150°C

•

Maximum Thermal Resistance; 13

°C/W Junction To Lead

MCC

Catalog

Number

Device

Marking

Maximum

Reccurrent

Peak Reverse

Voltage

Maximum

RMS

Voltage

Maximum

DC

Blocking

Voltage

GS2AFL

GS2A

50V

35V

50V

GS2BFL

GS2B

100V

70V

100V

GS2DFL

GS2D

200V

140V

200V

GS2GFL

GS2G

400V

280V

400V

GS2JFL

GS2J

600V

420V

600V

GS2KFL

GS2K

800V

560V

800V

GS2MFL

GS2M

1000V

700V

1000V

Electrical Characteristics @ 25

℃ Unless Otherwise Specified

Average Forward

current

2.0A

°C

Peak Forward Surge

Current

50A

8.3ms, half sine,

Maximum

Instantaneous

Forward Voltage

1.1V

°C*

Maximum DC

Reverse Current At

Rated DC Blocking

Voltage

5

µA

125

µA

°C

°C

Typical Junction

Capacitance

20pF

Measured at

omponents

20736 Marilla Street Chatsworth



 !"#

$%    !"#

•

Extremely Low Thermal Resistance

•

High Temp Soldering: 260

°C for 10 Seconds At Terminals

Revision:

E

2017/12/28

Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates

Compliant. See ordering information)

*Pulse test: Pulse width 300

µsec, Duty cycle 2%

Note 1: High Temperature Solder Exemptions Applied, see EU Directive Annex 7

a.

1 of

3

•

Epoxy meets UL 94 V-0 flammability rating

•

Moisture Sensitivity Level 1

DIMENSIONS

INCHES

MM

DIM

MIN

MAX

MIN

MAX

NOTE

A

.



.047

0.90

1.20

E

.0



.







C

.004

.01



0.10

0.



D

.0



.



.



E

.173

.2



4.40

5.



(

.126

.



3.20



/

.028

.0



0

1.



SUGGESTED SOLDER

PAD LAYOUT

(SMA-FL)

DO-221AC

•

Halogen free available upon request by adding suffix "-HF"

Features

0.075

(1.9)

0.063

(1.6)

0.232

(5.9)

0.106

(2.7)

Micro Commercial Components

M C C

R

Maximum Reverse

Recovery Time

2.1us(Typ.)

4us(Max)

IF=0.5A, IR=1.0A,

Irr=0.25A