6

ADC14155QML-SP

SNAS378J – NOVEMBER 2008 – REVISED MARCH 2018

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Copyright © 2008–2018, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are measured with respect to GND = AGND = DGND = DRGND = 0 V, unless otherwise specified.

(3)

limited to ±5 mA. The ±50-mA maximum package input current rating limits the number of pins that can safely exceed the power

supplies with an input current of ±5 mA to 10.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

−0.3

4.2

V

−0.3

2.35

V

100

mV

Voltage on any input pin (not to exceed 4.2 V)

−0.3

V

Voltage on any output pin (not to exceed 2.35

V)

−0.3

V

Input current at any pin other than supply

–5

5

mA

–50

50

mA

150

°C

−65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2500

V

(1)

All voltages are measured with respect to GND = AGND = DGND = DRGND = 0 V, unless otherwise specified.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

NOM

MAX

UNIT

Operating temperature

–55

125

°C

3

3.6

V

1.6

2

V

CLK

–0.05

V

Clock duty cycle

30%

70%

Analog input pins

0

2.6

V

1.4

1.6

V

|AGND-DGND|

100

mV

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

ADC14155QML

UNIT

NBA (CFP)

48 PINS

Junction-to-ambient thermal resistance

21.8

°C/W

Junction-to-case (top) thermal resistance

0.68

°C/W

Junction-to-top characterization parameter

1.86

°C/W