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MP2122 Arkusz danych(PDF) 14 Page - Monolithic Power Systems |
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MP2122 Arkusz danych(HTML) 14 Page - Monolithic Power Systems |
14 / 16 page MP2122 –6V, 2A, LOW QUIESCENT CURRENT, DUAL, SYNC BUCK REGULATOR MP2122 Rev. 1.02 www.MonolithicPower.com 14 6/12/2017 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2017 MPS. All Rights Reserved. Switching Loss (SW) MOSFET Driver Current (DR) Supply Current (S) Based on these parameters, we can estimate the power loss as: LOSS Cond DT SW DR S PP P P P P Thermal Regulation As previously discussed, changes in IC temperature change the electrical characteristics, especially when the temperature exceeds the IC’s recommended operating range. Managing the IC’s temperature requires additional considerations to ensure that the IC runs below the maximum-allowable temperature. While operating the IC within recommended electrical limits is a major component to maintaining proper thermal regulation, specific layout designs can improve the thermal profile while limiting costs to either efficiency or operating range. For the MP2122, connect the ground pin on the package to a GND plane on top of the PCB to use this plane as a heat sink. Connect this GND plane to GND planes beneath the IC using vias to further improve heat dissipation. However, given that these GND planes can introduce unwanted EMI noise and occupy valuable PCB space, design the size and shape of these planes to match the thermal resistance requirement: SA JA JC However, connecting the GND pin to a heat sink can not guarantee that the IC will not exceed its recommended temperature limits; for instance, if the ambient temperature exceeds the IC’s temperature limits. If the ambient air temperature approaches the IC’s temperature limit, options such as derating the IC so it operates using less power can help prevent thermal damage and unwanted electrical characteristics. PCB Layout Proper layout of the switching power supplies is very important, and sometimes critical for proper function: poor layout design can result in poor line or load regulation and stability issues. Place the high-current paths (GND, IN and SW) very close to the device with short, direct, and wide traces. Place the input capacitor as close as possible to the IN and GND pins. Place the external feedback resistors next to the FB pin. Keep the switching node SW short and away from the feedback network. The circuit of below PCB layout is shown in Figure 4. 1 8 7 6 5 OUT1 EN2 SW1 VIN C1A C1B R1 R2 AGND SW2 OUT2 EN1 R3 R4 C3 C4 C6 C5 GND 2 3 4 Figure 3: Suggested PCB Layout Design Example Below is a design example following the application guidelines for the specifications: Table 3: Design Example VIN 5V VOUT1 1.8V VOUT2 1.2V The detailed application schematic is shown in Figure 4. The typical performance and circuit waveforms have been shown in the Typical Performance Characteristics section. For more device applications, please refer to the related Evaluation Board Datasheets. |
Podobny numer części - MP2122 |
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Podobny opis - MP2122 |
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