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FAN3121 Arkusz danych(PDF) 2 Page - ON Semiconductor |
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FAN3121 Arkusz danych(HTML) 2 Page - ON Semiconductor |
2 / 21 page www.onsemi.com 2 Ordering Information Part Number Logic Input Threshold Package Packing Method Quantity per Reel FAN3121CMPX Inverting Channels + Enable CMOS 3x3 mm MLP-8 Tape & Reel 3,000 FAN3121CMX SOIC-8 Tape & Reel 2,500 FAN3121CMX -F085 (1) SOIC-8 Tape & Reel 2,500 FAN3121TMPX TTL 3x3 mm MLP-8 Tape & Reel 3,000 FAN3121TMX SOIC-8 Tape & Reel 2,500 FAN3121TMX -F085 (1) SOIC-8 Tape & Reel 2,500 FAN3122CMPX Non-Inverting Channels + Enable CMOS 3x3 mm MLP-8 Tape & Reel 3,000 FAN3122CMX SOIC-8 Tape & Reel 2,500 FAN3122CMX -F085 (1) SOIC-8 Tape & Reel 2,500 FAN3122TMPX TTL 3x3 mm MLP-8 Tape & Reel 3,000 FAN3122TMX SOIC-8 Tape & Reel 2,500 FAN3122TMX -F085 (1) SOIC-8 Tape & Reel 2,500 Note: 1. Qualified to AEC-Q100. Package Outlines 1 8 7 2 6 3 4 5 2 3 8 6 1 4 7 5 Figure 3. 3x3 mm MLP-8 (Top View) Figure 4. SOIC-8 (Top View) Thermal Characteristics(2) Package ΘJL (3) ΘJT (4) ΘJA (5) ΨJB (6) ΨJT (7) Units 8-Lead 3x3 mm Molded Leadless Package (MLP) 1.2 64 42 2.8 0.7 °C/W 8-Pin Small Outline Integrated Circuit (SOIC) 38 29 87 41 2.3 °C/W Notes: 2. Estimates derived from thermal simulation; actual values depend on the application. 3. Theta_JL (ΘJL): Thermal resistance between the semiconductor junction and the bottom surface of all the leads (including any thermal pad) that are typically soldered to a PCB. 4. Theta_JT (ΘJT): Thermal resistance between the semiconductor junction and the top surface of the package, assuming it is held at a uniform temperature by a top-side heatsink. 5. Theta_JA (ΘJA): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking, and airflow. The value given is for natural convection with no heatsink, as specified in JEDEC standards JESD51-2, JESD51-5, and JESD51-7, as appropriate. 6. Psi_JB (ΨJB): Thermal characterization parameter providing correlation between semiconductor junction temperature and an application circuit board reference point for the thermal environment defined in Note 5. For the MLP-8 package, the board reference is defined as the PCB copper connected to the thermal pad and protruding from either end of the package. For the SOIC-8 package, the board reference is defined as the PCB copper adjacent to pin 6. 7. Psi_JT (ΨJT): Thermal characterization parameter providing correlation between the semiconductor junction temperature and the center of the top of the package for the thermal environment defined in Note 5. |
Podobny numer części - FAN3121 |
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Podobny opis - FAN3121 |
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