MC-7845, 7846, 7847

Life Support Applications

These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably

be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and

agree to fully indemnify CEL for all damages resulting from such improper use or sale.

PART NUMBER

PACKAGE

QUANTITY

MC-7845

7-pin special with heatsink

50pcs max/ Tray

MC-7846

7-pin special with heatsink

50pcs max/ Tray

MC-7847

7-pin special with heatsink

50pcs max/ Tray

ORDERING INFORMATION

ABSOLUTE

SYMBOLS

PARAMETERS

UNITS

RATINGS

Supply Voltage

V

30

dBmV

65

Operating Case Temperature

°C

-30 to +100

Storage Temperature

°C

-40 to +100

Note:

1. Operation in excess of any one of these parameters may result

in permanent damage.

2. Maximum single channel power applied to the input for 1 minute

with no measurable degradation in performance.

PART NUMBER

MC-7845

MC-7846

MC-7847

SYMBOLS

CHARACTERISTICS

UNITS

MIN

TYP MAX

MIN

TYP

MAX

MIN

TYP

MAX

TEST CONDITIONS

IDD

Operating Current

mA

275

–

375

275

–

375

275

–

375

RF OFF

CTB

Composite Triple Beat

dBc

–

-63

-60

–

-63

-60

–

-65

-60

110 Channels,

XMod

dBc

–

-59

-55

–

-60

-55

–

-62

-55

CSO

Composite Second Order

dBc

–

-68

-63

–

-67

-63

–

-67

-63

745.25 MHz, 10 dB tilted

across the band

SYMBOLS

PARAMETERS

UNITS

MIN

TYP MAX

Supply VoltageV

23.5

24.0

24.5

dBmV

–

36.0

39.0

MC-7846

–

32.0

35.0

MC-7847

–

29.0

32.0

Operating Case

°C

-30

+25

+85

Temperature

RECOMMENDED

Note:

1. Test Conditions: 110 Channels, 10 dB tilted across the band.

1. The space between PC board and root of the lead should be

kept more than 1 mm to prevent undesired stress on the lead and

also should be kept less than 4 mm to prevent undesired parasitic

inductance.

Recommended space is 2.0 to 3.0 mm typical.

2. Recommended torque strength of the screw is 59 to 78 Ncm.

3. Form the ground pattern as wide as possible to minimize ground

impedance. (to prevent undesired oscillation)

All the ground pins must be connected together with wide ground

pattern to decrease impedance difference.

NOTES ON CORRECT USE

This product should be soldered in the following recommended

conditions. Other soldering methods and conditions than the

recommended conditions are to be consulted with our sales

representatives.

RECOMMENDED SOLDERING CONDITIONS

Soldering

Soldering

Condition

Method

Conditions

Symbol

Pin Part Heating

Pin area temperature: less

–

Hour: Within 2 sec./pin

Note.

1. The point of pin part heating must be kept at a distance of more

than 1.2 mm from the root of lead.

1. Measured per US standard methods and procedures (using selective level meter).

07/08/2003