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CS5206-5 Arkusz danych(PDF) 7 Page - ON Semiconductor

Numer części CS5206-5
Szczegółowy opis  6.0 A Adjustable, and Fixed 3.3 V and 5.0 V Linear Regulators
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Producent  ONSEMI [ON Semiconductor]
Strona internetowa  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

CS5206-5 Arkusz danych(HTML) 7 Page - ON Semiconductor

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CS5206−1, CS5206−3, CS5206−5
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7
temperatures accurately to ensure that an adequate heat sink
is used.
The case is connected to VOUT on the CS5206−X,
electrical isolation may be required for some applications.
Thermal compound should always be used with high current
regulators such as these.
The thermal characteristics of an IC depend on the
following four factors:
1.
Maximum Ambient Temperature TA (°C)
2.
Power dissipation PD (Watts)
3.
Maximum junction temperature TJ (°C)
4.
Thermal resistance junction to ambient RΘJA (°C/W)
These four are related by the equation
TJ + TA ) PD
R
QJA
(1)
The maximum ambient temperature and the power
dissipation are determined by the design while the
maximum junction temperature and the thermal resistance
depend on the manufacturer and the package type.
The maximum power dissipation for a regulator is:
PD(max) + {VIN(max) * VOUT(min)}IOUT(max) ) VIN(max)IQ
(2)
where:
VIN(max) is the maximum input voltage,
VOUT(min) is the minimum output voltage,
IOUT(max) is the maximum output current, for the application
IQ is the maximum quiescent current at IOUT(max).
A heat sink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and the
outside environment has a thermal resistance. Like series
electrical resistances, these resistances are summed to
determine RΘJA, the total thermal resistance between the
junction and the surrounding air.
1.
Thermal Resistance of the junction to case, RΘJC
(
°C/W)
2.
Thermal Resistance of the case to Heat Sink, RΘCS
(
°C/W)
3.
Thermal Resistance of the Heat Sink to the ambient
air, RΘSA (°C/W)
These are connected by the equation:
R
QJA + RQJC ) RQCS ) RQSA
(3)
The value for RΘJA is calculated using equation (3) and
the result can be substituted in equation (1).
The value for RΘJC is normally quoted as a single figure
for a given package type based on an average die size. For
a high current regulator such as the CS5206−X the majority
of the heat is generated in the power transistor section. The
value for RΘJSA depends on the heat sink type, while RΘJCS
depends on factors such as package type, heat sink interface
(is an insulator and thermal grease used?), and the contact
area between the heat sink and the package. Once these
calculations are complete, the maximum permissible value
of RΘJA can be calculated and the proper heat sink selected.
For further discussion on heat sink selection, see application
note
“Thermal
Management,”
document
number
AND8036/D, available through the Literature Distribution
Center or via our website at http://onsemi.com.
ORDERING INFORMATION
Orderable Part Number
Type
Package
Shipping†
CS5206−1GT3
6.0 A, Adj. Output
TO−220−3, Straight
50 Units/Rail
CS5206−1GDP3
6.0 A, Adj. Output
D2PAK−3
50 Units/Rail
CS5206−1GDPR3
6.0 A, Adj. Output
D2PAK−3
750 Tape & Reel
CS5206−3GT3
6.0 A, 3.3 V Output
TO−220−3, Straight
50 Units/Rail
CS5206−3GDP3
6.0 A, 3.3 V Output
D2PAK−3
50 Units/Rail
CS5206−3GDPR3
6.0 A, 3.3 V Output
D2PAK−3
750 Tape & Reel
CS5206−5GT3
6.0 A, 5.0 V Output
TO−220−3, Straight
50 Units/Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.


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