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IRF6636 Arkusz danych(PDF) 3 Page - International Rectifier

Numer części IRF6636
Szczegółowy opis  Low Resistance and Low Charge Along With Ultra Low Package Inductance to Reduce
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Producent  IRF [International Rectifier]
Strona internetowa  http://www.irf.com
Logo IRF - International Rectifier

IRF6636 Arkusz danych(HTML) 3 Page - International Rectifier

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IRF6636
www.irf.com
3
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
Surface mounted on 1 in. square Cu board, steady state.
Used double sided cooling , mounting pad.
Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
Notes:
TC measured with thermocouple incontact with top (Drain) of part.
Rθ is measured at TJ of approximately 90°C.
Surface mounted on 1 in. square Cu
board (still air).
Mounted on minimum
footprint full size board with
metalized back and with small
clip heatsink (still air)
Mounted to a PCB with a
thin gap filler and heat sink.
(still air)
Absolute Maximum Ratings
Parameter
Units
PD @TA = 25°C
Power Dissipation
W
PD @TA = 70°C
Power Dissipation
PD @TC = 25°C
Power Dissipation
TP
Peak Soldering Temperature
°C
TJ
Operating Junction and
TSTG
Storage Temperature Range
Thermal Resistance
Parameter
Typ.
Max.
Units
RθJA
Junction-to-Ambient
–––
58
RθJA
Junction-to-Ambient
12.5
–––
RθJA
Junction-to-Ambient
20
–––
°C/W
RθJC
Junction-to-Case
–––
3.0
RθJ-PCB
Junction-to-PCB Mounted
1.0
–––
Linear Derating Factor
W/°C
0.017
270
-40 to + 150
Max.
42
2.2
1.4
1E-006
1E-005
0.0001
0.001
0.01
0.1
1
10
100
t1 , Rectangular Pulse Duration (sec)
0.001
0.01
0.1
1
10
100
0.20
0.10
D = 0.50
0.02
0.01
0.05
SINGLE PULSE
( THERMAL RESPONSE )
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
τ
J
τ
J
τ
1
τ
1
τ
2
τ
2
τ
3
τ
3
R
1
R
1
R
2
R
2
R
3
R
3
Ci=
τi/Ri
Ci=
τi/Ri
τ
4
τ
4
R
4
R
4
τ
C
τ
C
τ
5
τ
5
R
5
R
5
Ri (°C/W)
τi (sec)
0.6677
0.000066
1.0463
0.000896
1.5612
0.004386
29.2822 0.686180
25.4550 32


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