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MSB601 Arkusz danych(PDF) 3 Page - Bytesonic Electronics Co., Ltd. |
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MSB601 Arkusz danych(HTML) 3 Page - Bytesonic Electronics Co., Ltd. |
3 / 3 page Suggested Soldering Temperature Profile Recom m ended reflow m ethods: IR, vapor phase oven, hot air oven, wave solder. The device can be exposed to a m axim um tem perature of 265°C for 10 seconds. Devices can be cleaned using standard industry m ethods and solvents. If reflow temperatures exceed the recom m ended profile, devices m ay not m eet the p erfo rm a nce re q uire m e nts. Note Package Information Carrier Dimension(mm) A0 B0 K0 D0 6.90 4.0 8.60 12.0 1.65 2.0 1.55 0.30 1.75 16 E F 7.50 P0 P1 P2 T W 0.1 Tolerance Package Specifications Package Reel Size Q'TY/Reel Box Size MSBL 13' 3 338 6 QTY/Box Carton Size 365*365*360 Reel DIA. 330 (mm) (Kpcs) Q'TY/Carton 48 (mm) (mm) (Kpcs) (Kpcs) MSB601~MSB607 Version 1.1 2018/2/27 http://www.bytesonic.com .tw/ |
Podobny numer części - MSB601 |
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Podobny opis - MSB601 |
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