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BQ25619 Arkusz danych(PDF) 5 Page - Texas Instruments |
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BQ25619 Arkusz danych(HTML) 5 Page - Texas Instruments |
5 / 59 page 5 BQ25619 www.ti.com SLUSDF8A – JUNE 2019 – REVISED JULY 2019 Product Folder Links: BQ25619 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Pin Functions (continued) PIN TYPE(1) DESCRIPTION NAME NO. QON 12 DI BATFET enable/reset control input. When the BATFET is in ship mode, a logic LOW of tSHIPMODE duration turns on BATFET to exit ship mode. When the BATFET is not in ship mode, a logic LOW of tQON_RST (minimum 8 s) duration resets SYS (system power) by turning BATFET off for tBATFET_RST (minimum 250 ms) and then re-enables BATFET to provide full system power reset. The host chooses the BATFET reset function with VBUS unplug or not through I2C bit BATFET_RST_WVBUS. The pin is pulled up to VBAT through 200 kΩ to maintain default HIGH logic during ship mode. It has an internal clamp to 6.5 V. REGN 22 P PWM low side driver positive supply output. Internally, REGN is connected to the anode of the boost-strap diode. Connect a 4.7-μF (10-V rating) ceramic capacitor from REGN to analog GND. The capacitor should be placed close to the IC. SCL 5 DI I2C interface clock. Connect SCL to the logic rail through a 10-kΩ resistor. SDA 6 DIO I2C interface data. Connect SDA to the logic rail through a 10-kΩ resistor. STAT 4 DO Open-drain interrupt output. Connect the STAT pin to a logic rail via 10-k Ω resistor. The STAT pin indicates charger status. Charge in progress: LOW Charge complete or charger in SLEEP mode: HIGH Charge suspend (fault response): Blink at 1 Hz SW 19 P Switching node connecting to output inductor. Internally SW is connected to the source of the n- channel HSFET and the drain of the n-channel LSFET. Connect the 0.047-μF bootstrap capacitor from SW to BTST. 20 SYS 15 P Converter output connection point. The internal current sensing resistor is connected between SYS and BAT. Connect a 10 µF (min) closely to the SYS pin. 16 TS 11 AI Battery temperature qualification voltage input. Connect a negative temperature coefficient thermistor (NTC). Program temperature window with a resistor divider from REGN to TS to GND. Charge and boost mode suspend when TS pin voltage is out of range. When TS pin is not used, connect a 10-kΩ resistor from REGN to TS and a 10-kΩ resistor from TS to GND or set TS_IGNORE to HIGH to ignore TS pin. It is recommended to use a 103AT-2 thermistor. VAC 1 AI Input voltage sensing. This pin must be tied to VBUS. VBUS 24 P Charger input voltage. The internal n-channel reverse block MOSFET (RBFET) is connected between VBUS and PMID with VBUS on source. Place a 1-uF ceramic capacitor from VBUS to GND and place it as close as possible to IC. Thermal Pad — P Ground reference for the device that is also the thermal pad used to conduct heat from the device. This connection serves two purposes. The first purpose is to provide an electrical ground connection for the device. The second purpose is to provide a low thermal-impedance path from the device die to the PCB. This pad should be tied externally to a ground plane. |
Podobny numer części - BQ25619_V01 |
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Podobny opis - BQ25619_V01 |
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