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DBV OR DCK PACKAGE

(TOP VIEW)

1

2

3

5

4

NC

A

GND

Y

NC - No internal connection

DNU - Do not use

3

2

1

4

5

GND

A

DNU

Y

YEA, YEP, YZA, OR YZP PACKAGE

(BOTTOM VIEW)

DESCRIPTION/ORDERING INFORMATION

SN74AUC1G06

SINGLE INVERTER BUFFER/DRIVER

WITH OPEN-DRAIN OUTPUT

SCES372J – SEPTEMBER 2001 – REVISED JUNE 2005

•

Available in the Texas Instruments

NanoStar™ and NanoFree™ Packages

•

Optimized for 1.8-V Operation and Is 3.6-V I/O

Tolerant to Support Mixed-Mode Signal

Operation

•

Operation

•

Sub-1-V Operable

•

•

Low Power Consumption, 10-

µA Max I

CC

•

±8-mA Output Drive at 1.8 V

•

Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

•

ESD Protection Exceeds JESD 22

– 2000-V Human-Body Model (A114-A)

– 200-V Machine Model (A115-A)

– 1000-V Charged-Device Model (C101)

The output of the SN74AUC1G06 is open drain and can be connected to other open-drain outputs to implement

active-low wired-OR or active-high wired-AND functions.

NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the

die as the package.

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoStar™ – WCSP (DSBGA)

SN74AUC1G06YEAR

0.17-mm Small Bump – YEA

NanoFree™ – WCSP (DSBGA)

0.17-mm Small Bump – YZA

SN74AUC1G06YZAR

(Pb-free)

Tape and reel

_ _ _UT_

NanoStar™ – WCSP (DSBGA)

SN74AUC1G06YEPR

–40°C to 85°C

0.23-mm Large Bump – YEP

NanoFree™ – WCSP (DSBGA)

0.23-mm Large Bump – YZP

SN74AUC1G06YZPR

(Pb-free)

SOT (SOT-23) – DBV

Tape and reel

SN74AUC1G06DBVR

U06_

SOT (SC-70) – DCK

Tape and reel

SN74AUC1G06DCKR

UT_

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2)

DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.

YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one

following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

⋅ = Pb-free).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoStar, NanoFree are trademarks of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 2001–2005, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.