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FAN5069 Rev. 1.1.0

Thermal Information

Recommended Operating Conditions

Notes:

1. Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating

only and functional operation of the device at these or any other conditions above those indicated in the operational section of this

specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Absolute maximum ratings apply individually only, not in combination. Unless otherwise specified all other voltages are referenced

to AGND.

2. Using Mil Std. 883E, method 3015.7(Human Body Model) and EIA/JESD22C101-A (Charge Device Model).

3. Junction to ambient thermal resistance,

θ

planes, number of vias used, diameter of vias used, available copper surface, and attached heat sink characteristics.

Parameter

Min.

Max.

Unit

6V

BOOT to PGND

33

V

SW to PGND

Continuous

-0.5

33

V

Transient (t < 50nS, F < 500kHz)

-3

33

V

6V

LDRV

-0.5

6

V

All Other Pins

-0.3

V

150

mA

Electrostatic Discharge Protection (ESD) Level (Note 2)

HBM

2

kV

CDM

0.4

Parameter

Min.

Typ.

Max.

Unit

Storage Temperature

-65

150

°C

Lead Soldering Temperature, 10 Seconds

300

°C

Vapor Phase, 60 Second

215

°C

Infrared, 15 Seconds

220

°C

715

mW

Thermal Resistance- Junction to Case(

θ

°C/W

Thermal Resistance- Junction to Ambient (

θ

100

°C/W

Parameter

Conditions

Min.

Typ.

Max.

Unit

4.5

5

5.5

V

Commercial

-10

85

°C

Industrial

-40

85

°C

125

°C