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DRV8353M Arkusz danych(PDF) 61 Page - Texas Instruments |
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DRV8353M Arkusz danych(HTML) 61 Page - Texas Instruments |
61 / 76 page 2 V 1.4 V R 2 W 28.3 R R 2.5 m A 40 A ! u o : u (18) V V 1.4 V 2.5 m A 14 A 40 A : ! o ! u (19) Therefore, the gain setting must be selected as 20 V/V or 40 V/V and the value of the sense resistor must be less than 2.5 mΩ to meet the power requirement for the sense resistor. For this example, the gain setting was selected as 20 V/V. The value of the resistor and worst case current can be verified that R < 2.5 mΩ and Imax = 40 A does not violate the differential range specification of the sense amplifier input (VSPxD). 14.2.1.2.5 Single Supply Power Dissipation Design care must be taken to make sure that the thermal ratings of the DRV8353M are not violated during normal operation of the device. The is especially critical in higher voltage and higher ambient operation applications where power dissipation or the device ambient temperature are increased. To determine the temperature of the device in single supply operation, first the power internal power dissipation must be calculated. The internal power dissipation has four primary components: • VCP charge pump power dissipation (PVCP) • VGLS low-side regulator power dissipation (PVGLS) • VM device nominal power dissipation (PVM) • VIN buck regulator power dissipation (PBUCK) The values of PVCP and PVGLS can be approximated by referring to Section 14.2.1.2.1 to first determine IVCP and IVGLS and then referring to Equation 20 and Equation 21. PVCP = IVCP × (VVM + VVDRAIN) (20) PVGLS = IVGLS × VVM (21) The value of PVM can be calculated by referring to the data sheet parameter for IVM current and Equation 22. PVM = IVM × VVM (22) PBUCK = (PO / η) - PO (23) where • PO = VVCC × IVCC The value of PBUCK can be calculated with the buck output voltage (VVCC), buck output current (IVCC), and by referring to the typical characteristic curve for efficiency (η) in the LM5008A data sheet. The total power dissipation is then calculated by summing the four components as shown in Equation 24. Ptot = PVCP + PVGLS + PVM + PBUCK (24) Lastly, the device junction temperature can be estimate by referring to Section 10 and Equation 25. TJmax = TAmax + (RθJA × Ptot) (25) The information in Section 10 is based off of a standardized test metric for package and PCB thermal dissipation. The actual values may vary based on the actual PCB design used in the application. 14.2.1.2.6 Single Supply Power Dissipation Example In this application example the device is configured for single supply operation. This configuration requires only one power supply for the DRV8353M but comes at the tradeoff of increased internal power dissipation. The junction temperature is estimated in the example below. www.ti.com DRV8353M SLVSFO2 – JULY 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 61 Product Folder Links: DRV8353M |
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