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LM60440 Arkusz danych(PDF) 21 Page - Texas Instruments

Numer części LM60440
Szczegółowy opis  LM604x0 3.8-V to 36-V, 3-A, and 4-A Ultra-Small Synchronous Step-Down Converter
Download  38 Pages
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Producent  TI [Texas Instruments]
Strona internetowa  http://www.ti.com
Logo TI - Texas Instruments

LM60440 Arkusz danych(HTML) 21 Page - Texas Instruments

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21
LM60440, LM60430
www.ti.com
SNVSBN5A – FEBRUARY 2020 – REVISED JUNE 2020
Product Folder Links: LM60440 LM60430
Submit Documentation Feedback
Copyright © 2020, Texas Instruments Incorporated
Figure 10. Setup for External UVLO Application
where
VON = VIN turnon voltage
VOFF = VIN turnoff voltage
(9)
9.2.2.11 Maximum Ambient Temperature
As with any power conversion device, the LM604x0 dissipates internal power while operating. The effect of this
power dissipation is to raise the internal temperature of the converter above ambient. The internal die
temperature (TJ) is a function of the ambient temperature, the power loss, and the effective thermal resistance,
RθJA, of the device and PCB combination. The maximum internal die temperature for the LM604x0 must be
limited to 150°C. This establishes a limit on the maximum device power dissipation and therefore the load
current. Equation 10 shows the relationships between the important parameters. It is easy to see that larger
ambient temperatures (TA) and larger values of RθJA reduce the maximum available output current. The converter
efficiency can be estimated by using the curves provided in this data sheet. If the desired operating conditions
cannot be found in one of the curves, then interpolation can be used to estimate the efficiency. Alternatively, the
EVM can be adjusted to match the desired application requirements and the efficiency can be measured directly.
The correct value of RθJA is more difficult to estimate. As stated in the Semiconductor and IC Package Thermal
Metrics Application Report, the value of RθJA given in the Thermal Information table is not valid for design
purposes and must not be used to estimate the thermal performance of the application. The values reported in
that table were measured under a specific set of conditions that are rarely obtained in an actual application.
where
η = efficiency
(10)
The effective RθJA is a critical parameter and depends on many factors such as power dissipation, air
temperature/flow, PCB area, copper heat-sink area, number of thermal vias under the package, and adjacent
component placement, just to mention just a few. The copper area given in the graph is for each layer; the top
and bottom layers are 2 oz. copper each, while the inner layers are 1 oz. It must be remembered that the data
given in these graphs are for illustration purposes only, and the actual performance in any given application
depends on all of the previously mentioned factors.


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