OPA991_V05 datasheet(2/75 Pages) TI

Numer części	OPA991

Szczegółowy opis	OPAx991 40-V Rail-to-Rail Input/Output, Low Offset Voltage, Low Noise Op Amp

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Producent	TI [Texas Instruments]

Strona internetowa	http://www.ti.com

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2 / 75 page

Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Pin Configuration and Functions...................................4

Pin Functions: OPA991.....................................................4

Pin Functions: OPA991S.................................................. 5

Pin Functions: OPA2991...................................................6

Pin Functions: OPA2991S................................................ 7

Pin Functions: OPA4991...................................................9

Pin Functions: OPA4991S.............................................. 10

6 Specifications................................................................ 11

6.1 Absolute Maximum Ratings...................................... 11

6.2 ESD Ratings..............................................................11

6.3 Recommended Operating Conditions....................... 11

6.4 Thermal Information for Single Channel................... 11

6.5 Thermal Information for Dual Channel......................12

6.6 Thermal Information for Quad Channel.................... 12

6.7 Electrical Characteristics...........................................13

........................................................................................ 14

6.8 Typical Characteristics.............................................. 16

7 Detailed Description......................................................24

7.1 Overview................................................................... 24

7.2 Functional Block Diagram......................................... 24

7.3 Feature Description...................................................25

7.4 Device Functional Modes..........................................34

8 Application and Implementation.................................. 35

8.1 Application Information............................................. 35

8.2 Typical Applications.................................................. 35

9 Power Supply Recommendations................................37

10 Layout...........................................................................37

10.1 Layout Guidelines................................................... 37

10.2 Layout Example...................................................... 38

11 Device and Documentation Support..........................39

11.1 Device Support........................................................39

11.2 Documentation Support.......................................... 39

11.3 Related Links.......................................................... 39

11.4 Receiving Notification of Documentation Updates.. 39

11.5 Support Resources................................................. 40

11.6 Trademarks............................................................. 40

11.7 Electrostatic Discharge Caution.............................. 40

11.8 Glossary.................................................................. 40

12 Mechanical, Packaging, and Orderable

Information.................................................................... 41

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision C (May 2020) to Revision D (July 2020)

Page

• Updated the numbering format for tables, figures, and cross-references throughout the document..................1

• Deleted preview notation from SOIC-14 (D) package in Device Information .....................................................1

• Deleted preview notation from SOT-23-5 (DBV) package in Device Information .............................................. 1

• Deleted preview notation from SOT-23-6 (DBV) package in Device Information .............................................. 1

• Deleted preview notation from SC70 (DCK) package in Device Information .....................................................1

• Deleted preview notation from SOT-23-8 (DDF) package in Device Information .............................................. 1

• Deleted preview notation from TSSOP-14 (PW) package in Device Information .............................................. 1

• Removed preview notation on SOT-23-5 (DBV), and SC70 (DCK)....................................................................4

• Clarified SHDN notation in the OPA991S Pin Configuration and Functions section ......................................... 5

• Removed preview notation from SOT-23-6 (DBV) package in Pin Configuration and Functions section ..........5

• Removed preview notation from SOT-23-8 (DDF) package in Pin Configuration and Functions section ..........6

• Clarified SHDN notation in OPA2991S Pin Configuration and Functions section ............................................. 7

• Removed preview notation from SOIC-14 (D) and TSSOP-14 (PW) packages in Pin Configuration and

Functions section ...............................................................................................................................................7

• Clarified SHDN notation in OPA4991S Pin Configuration and Functions section ........................................... 10

Changes from Revision B (May 2020) to Revision C (May 2020)

Page

• Removed preview notation from TSSOP (PW) package in Pin Configuration and Functions section ...............5

• Removed preview notation from X2QFN (RUG) package in Pin Configuration and Functions section .............6

OPA991, OPA2991, OPA4991

SBOS969D – OCTOBER 2019 – REVISED JULY 2020

www.ti.com

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