6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply voltage

–0.5

7

V

Input clamp current(2)

±20

mA

Output clamp current(2)

±20

mA

Continuous output current

±35

mA

±70

mA

Junction temperature(3)

150

°C

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

(3)

Guaranteed by design.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/

JEDEC JS-001(1)

±4000

V

Charged-device model (CDM), per JEDEC

specification JESD22-C101(2)

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

2

5

6

V

Input voltage

0

V

Output voltage

0

V

Ambient temperature

–40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

SN74HCS264

UNIT

PW (TSSOP)

D (SOIC)

16 PINS

16 PINS

Junction-to-ambient thermal resistance

141.2

122.2

°C/W

Junction-to-case (top) thermal resistance

78.8

80.9

°C/W

Junction-to-board thermal resistance

85.8

80.6

°C/W

Junction-to-top characterization parameter

27.7

40.4

°C/W

Junction-to-board characterization parameter

85.5

80.3

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

SN74HCS264

SCLS844 – AUGUST 2020

www.ti.com

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