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IRF2804LPBF Arkusz danych(PDF) 2 Page - International Rectifier |
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2 / 12 page IRF2804/S/LPbF 2 www.irf.com Notes: Repetitive rating; pulse width limited by max. junction temperature. (See fig. 11). Limited by TJmax, starting TJ = 25°C, L=0.24mH, RG = 25Ω, IAS = 75A, VGS =10V. Part not recommended for use above this value. ISD ≤ 75A, di/dt ≤ 220A/µs, VDD ≤ V(BR)DSS, TJ ≤ 175°C. Pulse width ≤ 1.0ms; duty cycle ≤ 2%.
Coss eff. is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS. Limited by TJmax , see Fig.12a, 12b, 15, 16 for typical repetitive avalanche performance. This value determined from sample failure population. 100% tested to this value in production. This is applied to D2Pak, when mounted on 1" square PCB ( FR-4 or G-10 Material ). For recommended footprint and soldering techniques refer to application note #AN-994. Max RDS(on) for D2Pak and TO-262 (SMD) devices. TO-220 device will have an Rth value of 0.45°C/W. S D G S D G Static @ TJ = 25°C (unless otherwise specified) Parameter Min. Typ. Max. Units V(BR)DSS Drain-to-Source Breakdown Voltage40 ––– ––– V ∆ΒVDSS/∆TJ Breakdown Voltage Temp. Coefficient ––– 0.031 ––– V/°C RDS(on) SMD Static Drain-to-Source On-Resistance ––– 1.5 2.0 m Ω RDS(on) TO-220 Static Drain-to-Source On-Resistance ––– 1.8 2.3 VGS(th) Gate Threshold Voltage2.0 ––– 4.0 V gfs Forward Transconductance 130 ––– ––– S IDSS Drain-to-Source Leakage Current ––– ––– 20 µA ––– ––– 250 IGSS Gate-to-Source Forward Leakage ––– ––– 200 nA Gate-to-Source Reverse Leakage ––– ––– -200 Qg Total Gate Charge ––– 160 240 nC Qgs Gate-to-Source Charge ––– 41 62 Qgd Gate-to-Drain ("Miller") Charge ––– 66 99 td(on) Turn-On Delay Time ––– 13 ––– ns tr Rise Time ––– 120 ––– td(off) Turn-Off Delay Time ––– 130 ––– tf Fall Time ––– 130 ––– LD Internal Drain Inductance ––– 4.5 ––– nH Between lead, 6mm (0.25in.) LS Internal Source Inductance ––– 7.5 ––– from package and center of die contact Ciss Input Capacitance ––– 6450 ––– pF Coss Output Capacitance ––– 1690 ––– Crss Reverse Transfer Capacitance ––– 840 ––– Coss Output Capacitance ––– 5350 ––– Coss Output Capacitance ––– 1520 ––– Coss eff. Effective Output Capacitance ––– 2210 ––– Diode Characteristics Parameter Min. Typ. Max. Units IS Continuous Source Current ––– ––– 270 (Body Diode) A ISM Pulsed Source Current ––– ––– 1080 (Body Diode) Ã VSD Diode Forward Voltage ––– ––– 1.3 V trr Reverse Recovery Time ––– 5684ns Qrr Reverse Recovery Charge ––– 67 100 nC ton Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD) VDS = VGS, ID = 250µA VDS = 40V, VGS = 0V VDS = 40V, VGS = 0V, TJ = 125°C Conditions VGS = 0V, ID = 250µA Reference to 25°C, ID = 1mA VGS = 10V, ID = 75A f VGS = 10V, ID = 75A f TJ = 25°C, IF = 75A, VDD = 20V di/dt = 100A/µs f TJ = 25°C, IS = 75A, VGS = 0V f showing the integral reverse p-n junction diode. VGS = 0V, VDS = 1.0V, ƒ = 1.0MHz VGS = 10V f MOSFET symbol VGS = 0V VDS = 25V VGS = 0V, VDS = 32V, ƒ = 1.0MHz Conditions VGS = 0V, VDS = 0V to 32V ƒ = 1.0MHz, See Fig. 5 RG = 2.5Ω ID = 75A VDS = 10V, ID = 75A VDD = 20V ID = 75A VGS = 20V VGS = -20V VDS = 32V VGS = 10V f |
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