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MC100EP223 Arkusz danych(PDF) 4 Page - Motorola, Inc |
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MC100EP223 Arkusz danych(HTML) 4 Page - Motorola, Inc |
4 / 8 page MC100EP223 MOTOROLA TIMING SOLUTIONS DL207 — Rev 0 4 APPLICATIONS INFORMATION Using the thermally enhanced package of the MC100EP223 The MC100EP223 uses a thermally enhanced 64 lead LQFP package. This package provides the low thermal impedance that supports the power consumption of the MC100EP223 high-speed bipolar integrated circuit and eases the power management task for the system design. An exposed pad at the bottom of the package establishes thermal conductivity from the package to the printed circuit board. In order to take advantage of the enhanced thermal capabilitites of this package, it is recommended to solder the exposed pad of the package to the printed circuit board. The attachment process for exposed pad package is the same as for any standard surface mount package. Vias are recommended from the pad on the board down to an appropriate plane in the board that is capable of distributing the heat. In order to supply enough solder paste to fill those vias and not starve the solder joints, it may be required to stencil print solder paste onto the printed circuit pad. This pad should match the dimensions of the exposed pad. The dimensions of the exposed pad are shown on the package outline in this specification. For thermal system analysis and junction temperature calculation the thermal resistance parameters of the package is provided: Thermal Resistance Convection LFPM RTHJAa °C/W RTHJAb °C/W RTHJCc °C/W RTHJBd °C/W Natural 57.1 24.9 100 50.0 21.3 200 46.9 20.0 15.8 9.7 400 43.4 18.7 800 38.6 16.9 a. Junction to ambient, single layer test board, per JESD51-6 b. Junction to ambient, four conductor layer test board (2S2P), per JES51-6 c. Junction to case, per MIL-SPEC 883E, method 1012.1 d. Junction to board, four conductor layer test board (2S2P) per JESD 51-8 It is recommended that users employ thermal modeling analysis to assist in applying the general recommendations to their particular application. The exposed pad of the MC100EP223 package does not have an electrical low impedance path to the substrate of the integrated circuit and its terminals. |
Podobny numer części - MC100EP223 |
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Podobny opis - MC100EP223 |
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