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SI4726CY Arkusz danych(PDF) 2 Page - Vishay Siliconix |
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SI4726CY Arkusz danych(HTML) 2 Page - Vishay Siliconix |
2 / 9 page Si4726CY Vishay Siliconix www.vishay.com 2 Document Number: 71285 S-03075—Rev. C, 03-Feb-03 ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED) Parameter Symbol Steady State Unit Logic Supply VDD 7 Logic Inputs VIN - 0.7 to VDD + 0.3 Drain-Source Voltage VDS - 1.0 to 20 V Bootstrap Voltage VBOOT 7 Synchronous Pin Voltage VSYNC - 0.7 to VDD +0.3 Maximum Power Dissipationa PD 4 W Driver - 65 to 125 _ Operating Junction and Storage Temperature Range MOSFETs Tj, Tstg - 65 to 150 _C Notes a. Surface mounted on 1” x1” FR4 board, full copper two sides. b. Pulse test: pulse width v300 mS, duty cycle v2%. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS Parameter Symbol Steady State Unit Drain Voltage VD1 4.5 to 20 Logic Supply VDD 4.5 to 5.5 Input Logic High Voltage VIH 0.7 VDD to VDD V Input Logic Low Voltage VIL - 0.3 to 0.3 VDD Bootstrap Capacitor CBOOT 100 n to 1 m F Ambient Temperature TA - 40 to 85 _C THERMAL RESISTANCE RATINGS Parameter Symbol Typical Maximum Unit Highside Junction-to-Ambienta RthJA1 85 105 Lowside Junction-to-Ambienta RthJA2 68 85 _ Highside Junction-to-Foot (Drain)b Steady State RthJF1 24 30 _C/W Lowside Junction-to-Foot (Drain)b RthJF2 16 20 Notes a. Surface Mounted on 1” x 1” FR4 Board. b. Junction-to-foot thermal impedance represents the effective thermal impedance of all heat carrying leads in parallel and is intended for use in conjunction with the thermal impedance of the PC board pads to ambient (RthJA = RthJF + RthPCB-A). It can also be used to estimate chip temperature if power dissipation and the lead temperature of a heat carrying (drain) lead is known. |
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