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SI4726CY Arkusz danych(PDF) 2 Page - Vishay Siliconix

Numer części SI4726CY
Szczegółowy opis  N-Channel Synchronous MOSFETs with Break-Before-Make
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Si4726CY
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Document Number: 71285
S-03075—Rev. C, 03-Feb-03
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Steady State
Unit
Logic Supply
VDD
7
Logic Inputs
VIN
- 0.7 to VDD + 0.3
Drain-Source Voltage
VDS
- 1.0 to 20
V
Bootstrap Voltage
VBOOT
7
Synchronous Pin Voltage
VSYNC
- 0.7 to VDD +0.3
Maximum Power Dissipationa
PD
4
W
Driver
- 65 to 125
_
Operating Junction and Storage Temperature Range
MOSFETs
Tj, Tstg
- 65 to 150
_C
Notes
a.
Surface mounted on 1” x1” FR4 board, full copper two sides.
b.
Pulse test: pulse width
v300 mS, duty cycle v2%.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Steady State
Unit
Drain Voltage
VD1
4.5 to 20
Logic Supply
VDD
4.5 to 5.5
Input Logic High Voltage
VIH
0.7
VDD to VDD
V
Input Logic Low Voltage
VIL
- 0.3 to 0.3
VDD
Bootstrap Capacitor
CBOOT
100 n to 1
m
F
Ambient Temperature
TA
- 40 to 85
_C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Highside Junction-to-Ambienta
RthJA1
85
105
Lowside Junction-to-Ambienta
RthJA2
68
85
_
Highside Junction-to-Foot (Drain)b
Steady State
RthJF1
24
30
_C/W
Lowside Junction-to-Foot (Drain)b
RthJF2
16
20
Notes
a.
Surface Mounted on 1” x 1” FR4 Board.
b.
Junction-to-foot thermal impedance represents the effective thermal impedance of all heat carrying leads in parallel and is intended for use in conjunction with
the thermal impedance of the PC board pads to ambient (RthJA = RthJF + RthPCB-A). It can also be used to estimate chip temperature if power dissipation and
the lead temperature of a heat carrying (drain) lead is known.


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