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SN74AUC1G80DCKR Arkusz danych(PDF) 1 Page - Texas Instruments

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Numer części SN74AUC1G80DCKR
Szczegółowy opis  SINGLE POSITIVE-EDGE-TRIGERED D-TYPE FLIP-FLOP
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Producent  TI [Texas Instruments]
Strona internetowa  http://www.ti.com
Logo TI - Texas Instruments

SN74AUC1G80DCKR Arkusz danych(HTML) 1 Page - Texas Instruments

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SN74AUC1G80
SINGLE POSITIVEEDGETRIGGERED DTYPE FLIPFLOP
SCES388H − MARCH 2002 − REVISED FEBRUARY 2004
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D Available in the Texas Instruments
NanoStar
 and NanoFree Packages
D Optimized for 1.8-V Operation and Is 3.6-V
I/O Tolerant to Support Mixed-Mode Signal
Operation
D Ioff Supports Partial-Power-Down Mode
Operation
D Sub 1-V Operable
D Max tpd of 1.9 ns at 1.8 V
D Low Power Consumption, 10-µA Max ICC
D ±8-mA Output Drive at 1.8 V
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
description/ordering information
This single positive-edge-triggered D-type flip-flop is operational at 0.8-V to 2.7-V VCC, but is designed
specifically for 1.65-V to 1.95-V VCC operation.
When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on
the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related
to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without
affecting the levels at the outputs.
NanoStar
 and NanoFree package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING‡
NanoStar
WCSP (DSBGA) − YEA
Tape and reel
SN74AUC1G80YEAR
_ _ _UX_
−40
°C to 85°C
NanoFree
WCSP (DSBGA) − YZA (Pb-free)
Tape and reel
SN74AUC1G80YZAR
_ _ _UX_
SOT (SOT-23) − DBV
Tape and reel
SN74AUC1G80DBVR
U80_
SOT (SC-70) − DCK
Tape and reel
SN74AUC1G80DCKR
UX_
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site.
Copyright
 2004, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
DBV OR DCK PACKAGE
(TOP VIEW)
1
2
3
5
4
D
CLK
GND
VCC
Q
3
2
1
4
5
GND
CLK
D
Q
VCC
YEA OR YZA PACKAGE
(BOTTOM VIEW)
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
NanoStar and NanoFree are trademarks of Texas Instruments.


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