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MXR7202G Datasheet(Arkusz danych) 5 Page - List of Unclassifed Manufacturers

Numer części MXR7202G
Szczegółowy opis  Low Cost, Low Noise ±2 g Dual Axis Accelerometer with Ratiometric Analog Outputs
Pobierz  8 Pages
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Producent  ETC1 [List of Unclassifed Manufacturers]
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MEMSIC MXR7202G/M Rev.B
Page 5 of 8
3/24/2005
EXTERNAL FILTERS
AC Coupling: For applications where only dynamic
accelerations (vibration) are to be measured, it is
recommended to ac couple the accelerometer output as
shown in Figure 2. The advantage of ac coupling is that
zero g offset variations from part to part and zero g offset
change over temperature can be eliminated. Figure 3 is a
HFP (high pass filter) with a –3dB breakpoint given by the
equation:
RC
f
π
2
1
=
. In many applications it may be
desirable to have the HFP –3dB point at a very low
frequency in order to detect very low frequency
accelerations. Sometimes the implementation of this HFP
may result in unreasonably large capacitors, and the
designer may turn to digital implementations of HFPs
where very low frequency –3dB breakpoints can be
achieved.
A
OUTX
R
C
A
OUTY
R
C
A
OUTX
Filtered
Output
A
OUTY
Filtered
Output
Figure 2: High Pass Filter
Low Pass Filter: An external low pass filter would be
useful in low frequency applications such as tilt or
inclination. The low pass filter limits the noise floor and
improves the resolution of the accelerometer. The low pass
filter shown in Figure 4 has a –3dB breakpoint given by the
equation:
RC
f
π
2
1
=
. For the 200 Hz ratiometric output
device filter, C=0.1
µF and R=8kΩ, ±5%, 1/8W.
A
OUTX
R
C
A
OUTY
R
C
A
OUTX
Filtered
O utput
A
OUTY
Filtered
O utput
POWER SUPPLY NOISE REJECTION
One capacitor is recommended for best rejection of power
supply noise (reference Figure 4 below). The capacitor
should be located as close as possible to the device supply
pin (VDD). The capacitor lead length should be as short as
possible, and surface mount capacitor is preferred. For
typical applications, the capacitor can be ceramic 0.1 µF.
Figure 4: Power Supply Noise Rejection
PCB LAYOUT AND FABRICATION SUGGESTIONS
1.
Liberal use of ceramic bypass capacitors is
recommended. It is best to solder a 0.1uF capacitor
directly across VDD and COM pin.
2.
Robust low inductance ground wiring should be used.
3.
Care should be taken to ensure there is “thermal
symmetry” on the PCB immediately surrounding the
MEMSIC device and that there is no significant heat
source nearby.
4.
A metal ground plane should be added directly beneath
the MEMSIC device. The size of the plane should be
similar to the MEMSIC device’s footprint and be as
thick as possible.
5.
Vias can be added symmetrically around the ground
plane. Vias increase thermal isolation of the device
from the rest of the PCB.
Figure 3: Low Pass Filter




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