303 South Technology Court Broomfield, CO 80021
Phone: (800) SMI-MMIC
http://www.sirenza.com
2
EDS-104666 Rev B
Preliminary
SZP-3026Z 2.7-3.8GHz 2W Power Amp
Absolute Maximum Ratings
Parameters
Value
Unit
VC1 Collector Bias Current (IVC1)
1500
mA
Device Voltage (Vcc)
7.0
V
Power Dissipation
6
W
Operating Lead Temperature (TL)
-40 to +85
ºC
Max RF Input Power for 50 ohm output
load
27
dBm
Max RF Input Power for 10:1 VSWR out-
put load
23
dBm
Storage Temperature Range
-40 to +150
ºC
Operating Junction Temperature (TJ)
+150
ºC
ESD Human Body Model
500
V
Operation of this device beyond any one of these limits may
cause permanent damage. For reliable continuous operation
the device voltage and current must not exceed the maximum
operating values specified in the table on page one.
Bias conditions should also satisfy the following expression:
IDVD < (TJ - TL) / RTH’ j-l
Typical Performance with Appropriate App Circuit (Vcc=5V, Icq=460mA, * 802.11g 54Mb/s
Parameter
Units
2.7GHz
3.0GHz
3.3GHz
3.4GHz
3.5GHz
3.7GHz
3.8GHz
Gain@Pout=26dBm
dB
13
12.5
12.1
12.0
11.9
11.1
10.4
P1dB
dBm
33.5
33.5
33.6
33.9
33.6
32.7
32.3
Pout @ 2.5% EVM*
dBm
26
26
26
26
26
25.5
25
Current @ Pout 2.5% EVM*
mA
590
590
580
580
570
560
550
Input Return Loss
dB
15
15
17
16
15
12
12
Output Return Loss
dB
9
9
9
9
10
9
9
Caution: ESD Sensitive
Appropriate precaution in handling, packaging
and testing devices must be observed.
Pin Out Description
Pin #
Function
Description
1
VBIAS
This is the supply voltage for the active bias circuit.
2
RFIN
This is the RF input pin and has a DC voltage present. An external DC block is required.
3
VPC
Power up/down control pin. The voltage on this pin should never exceed the voltage on pin 3 by
more than 0.5V unless the supply current from pin 3 is limited < 10mA.
4
VDET
This is the output port for the power detector. It samples the power at the input of the amplifier.
5
RFOUT/VCC
This is the RF output pin and DC connection to the collector.
6
NC
This pin is not connected internal to the package. Buss it to pin 5 as shown on the app circuit to
achieve the specified performance.
GND
GND
These pins are DC connected to the backside paddle. They provide goos thermal connection to the
backside paddle for hand soldering and rework. Many thermal and electrical GND vias are recom-
mended as shown in the landing pattern.
Simplified Device Schematic
1
2
3
6
5
4
VBIAS
RFIN
VPC
VDET
RFOUT/VCC
NC
Bias
GND
GND
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