Zakładka z wyszukiwarką danych komponentów
  Polish  ▼
ALLDATASHEET.PL

X  

74HCT1G32 Arkusz danych(PDF) 11 Page - NXP Semiconductors

Numer części 74HCT1G32
Szczegółowy opis  2-input OR gate
Download  16 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Producent  PHILIPS [NXP Semiconductors]
Strona internetowa  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

74HCT1G32 Arkusz danych(HTML) 11 Page - NXP Semiconductors

Back Button 74HCT1G32 Datasheet HTML 7Page - NXP Semiconductors 74HCT1G32 Datasheet HTML 8Page - NXP Semiconductors 74HCT1G32 Datasheet HTML 9Page - NXP Semiconductors 74HCT1G32 Datasheet HTML 10Page - NXP Semiconductors 74HCT1G32 Datasheet HTML 11Page - NXP Semiconductors 74HCT1G32 Datasheet HTML 12Page - NXP Semiconductors 74HCT1G32 Datasheet HTML 13Page - NXP Semiconductors 74HCT1G32 Datasheet HTML 14Page - NXP Semiconductors 74HCT1G32 Datasheet HTML 15Page - NXP Semiconductors Next Button
Zoom Inzoom in Zoom Outzoom out
 11 / 16 page
background image
2002 May 15
11
Philips Semiconductors
Product specification
2-input OR gate
74HC1G32; 74HCT1G32
SOLDERING
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical reflow peak temperatures range from
215 to 250
°C. The top-surface temperature of the
packages should preferable be kept below 220
°C for
thick/large packages, and below 235
°C for small/thin
packages.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45
° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250
°C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300
°C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320
°C.


Podobny numer części - 74HCT1G32

ProducentNumer częściArkusz danychSzczegółowy opis
logo
NXP Semiconductors
74HCT1G32 NXP-74HCT1G32 Datasheet
75Kb / 11P
   2-input OR gate
Rev. 05-14 March 2008
logo
Nexperia B.V. All right...
74HCT1G32 NEXPERIA-74HCT1G32 Datasheet
207Kb / 11P
   2-input OR gate
Rev. 6 - 18 January 2022
logo
NXP Semiconductors
74HCT1G32GV NXP-74HCT1G32GV Datasheet
75Kb / 11P
   2-input OR gate
Rev. 05-14 March 2008
logo
Nexperia B.V. All right...
74HCT1G32GV NEXPERIA-74HCT1G32GV Datasheet
207Kb / 11P
   2-input OR gate
Rev. 6 - 18 January 2022
74HCT1G32GV-Q100 NEXPERIA-74HCT1G32GV-Q100 Datasheet
682Kb / 12P
   2-input OR gate
More results

Podobny opis - 74HCT1G32

ProducentNumer częściArkusz danychSzczegółowy opis
logo
Toshiba Semiconductor
TC7SET32F TOSHIBA-TC7SET32F Datasheet
166Kb / 5P
   2-INPUT OR GATE
TC7SL32F TOSHIBA-TC7SL32F Datasheet
211Kb / 5P
   2-INPUT OR GATE
logo
NXP Semiconductors
74AHC1G32 PHILIPS-74AHC1G32 Datasheet
80Kb / 12P
   2-input OR gate
1999 Jan 27
74AHC1G32 NXP-74AHC1G32 Datasheet
79Kb / 12P
   2-input OR gate
Rev. 07-14 May 2009
logo
Toshiba Semiconductor
TC7SL32F TOSHIBA-TC7SL32F_01 Datasheet
227Kb / 6P
   2-INPUT OR GATE
TC7SZ32AFE TOSHIBA-TC7SZ32AFE_07 Datasheet
154Kb / 5P
   2 Input OR Gate
TC7S32F TOSHIBA-TC7S32F_01 Datasheet
229Kb / 6P
   2-INPUT OR GATE
logo
Renesas Technology Corp
HD74ALVC1G32 RENESAS-HD74ALVC1G32_15 Datasheet
98Kb / 10P
   2-input OR Gate
logo
Unisonic Technologies
U7SH32 UTC-U7SH32_15 Datasheet
138Kb / 4P
   2-INPUT OR GATE
logo
Renesas Technology Corp
HD74ALVC1G32 RENESAS-HD74ALVC1G32 Datasheet
76Kb / 8P
   2-input OR Gate
logo
Toshiba Semiconductor
TC7SH32F TOSHIBA-TC7SH32F_09 Datasheet
173Kb / 7P
   2-Input OR Gate
More results


Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16


Arkusz danych Pobierz

Go To PDF Page


Link URL




Polityka prywatności
ALLDATASHEET.PL
Czy Alldatasheet okazała się pomocna?  [ DONATE ] 

O Alldatasheet   |   Reklama   |   Kontakt   |   Polityka prywatności   |   Linki   |   Lista producentów
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com