ADXRS150

Rev. A | Page 12 of 12

OUTLINE DIMENSIONS

A

B

C

D

E

F

G

BOTTOM

VIEW

7

A1

65

4

3

TOP VIEW

DETAIL A

3.65 MAX

SEATING

PLANE

DETAIL A

BALL DIAMETER

7.00 BSC SQ

4.80 BSC

0.60

0.55

0.50

3.20

2.50

0.44

0.25

0.15 MAX

COPLANARITY

0.80

BSC

A1 CORNER

INDEX AREA

21

Figure 28. 32-Lead Chip Scale Ball Grid Array [CSPBGA]

(BC-32)

Dimensions shown in millimeters

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the

human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

degradation or loss of functionality.

Table 4. Ordering Guide

ADXRS150 Products

Temperature Package

Package Description

Package Outline

ADXRS150ABG

–40°C to +85°C

32-Lead BGA

BC-32

ADXRS150ABG-Reel

–40°C to +85°C

32-Lead BGA

BC-32

© 2003 Analog Devices, Inc. All rights reserved. Trademarks and regis-

tered trademarks are the property of their respective companies.

Printed in the U.S.A.

C03226-0-1/03(A)