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ADP1711AUJZ-1.5-R7 Arkusz danych(PDF) 11 Page - Analog Devices

Numer części ADP1711AUJZ-1.5-R7
Szczegółowy opis  150 mA, Low Dropout, CMOS Linear Regulator
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Producent  AD [Analog Devices]
Strona internetowa  http://www.analog.com
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ADP1711AUJZ-1.5-R7 Arkusz danych(HTML) 11 Page - Analog Devices

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ADP1710/ADP1711
Rev. 0 | Page 11 of 16
Current and thermal limit protections are intended to protect
the device against accidental overload conditions. For reliable
operation, device power dissipation must be externally limited
so junction temperatures do not exceed 125°C.
THERMAL CONSIDERATIONS
To guarantee reliable operation, the junction temperature of the
ADP1710/ADP1711 must not exceed 125°C. To ensure the
junction temperature stays below this maximum value, the user
needs to be aware of the parameters that contribute to junction
temperature changes. These parameters include ambient
temperature, power dissipation in the power device, and thermal
resistances between the junction and ambient air (θJA). The θJA
number is dependent on the package assembly compounds used
and the amount of copper to which the GND pins of the package
are soldered on the PCB. Table 5 shows typical θJA values of the
5­lead TSOT package for various PCB copper sizes.
Table 5.
Copper Size (mm2)
θJA (°C/W)
01
170
50
152
100
146
300
134
500
131
1 Device soldered to minimum size pin traces.
The junction temperature of the ADP1710/ADP1711 can be
calculated from the following equation:
TJ = TA + (PD × θJA)
(2)
where:
TA is the ambient temperature.
PD is the power dissipation in the die, given by
PD = [(VIN – VOUT) × ILOAD] + (VIN × IGND)
(3)
where:
ILOAD is the load current.
IGND is the ground current.
VIN and VOUT are the input voltage and output voltage,
respectively.
Power dissipation due to ground current is quite small and can
be ignored. Therefore, the junction temperature equation
simplifies to the following:
TJ = TA + {[(VIN – VOUT) × ILOAD] × θJA}
(4)
As shown in Equation 4, for a given ambient temperature, input
to output voltage differential, and continuous load current,
there exists a minimum copper size requirement for the PCB to
ensure the junction temperature does not rise above 125°C. The
following figures show junction temperature calculations for
different ambient temperatures, load currents, VIN to VOUT
differentials, and areas of PCB copper.
140
0
0.5
5.0
VIN – VOUT (V)
120
100
80
60
40
20
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
1mA
10mA
30mA
80mA
100mA
125mA
150mA
(LOAD CURRENT)
MAX TJ (DO NOT OPERATE ABOVE THIS POINT)
Figure 23. 500 mm2 of PCB Copper, TA = 25°C
140
0
0.5
5.0
VIN – VOUT (V)
120
100
80
60
40
20
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
1mA
10mA
30mA
80mA
100mA
125mA
150mA
(LOAD CURRENT)
MAX TJ (DO NOT OPERATE ABOVE THIS POINT)
Figure 24. 100 mm2 of PCB Copper, TA = 25°C
140
0
0.5
5.0
VIN – VOUT (V)
120
100
80
60
40
20
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
1mA
10mA
30mA
80mA
100mA
125mA
150mA
(LOAD CURRENT)
MAX TJ (DO NOT OPERATE ABOVE THIS POINT)
Figure 25. 0 mm2 of PCB Copper, TA = 25°C


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