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ADT75ARZ-REEL7 Arkusz danych(PDF) 7 Page - Analog Devices |
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ADT75ARZ-REEL7 Arkusz danych(HTML) 7 Page - Analog Devices |
7 / 24 page ADT75 Rev. 0 | Page 7 of 24 ABSOLUTE MAXIMUM RATINGS Table 4. Parameter Rating VDD to GND –0.3 V to +7 V SDA Input Voltage to GND –0.3 V to VDD + 0.3 V SDA Output Voltage to GND –0.3 V to VDD + 0.3 V SCL Input Voltage to GND –0.3 V to VDD + 0.3 V OS/ALERT Output Voltage to GND –0.3 V to VDD + 0.3 V Operating Temperature Range –55°C to +150°C Storage Temperature Range –65°C to +160°C Maximum Junction Temperature, TJMAX 150.7°C 8-Lead MSOP (RM-8) Power Dissipation1, 2 WMAX = (TJMAX − TA)/θJA Thermal Impedance3 θJA, Junction-to-Ambient (Still Air) 205.9°C/W θJC, Junction-to-Case 43.74°C/W 8-Lead SOIC (R-8) Power Dissipation1, 2 WMAX = (TJMAX − TA)/θJA Thermal Impedance3 θJA, Junction-to-Ambient (Still Air) 157°C/W θJC, Junction-to-Case 56°C/W IR Reflow Soldering Peak Temperature 220°C (0°C/5°C) Time at Peak Temperature 10 sec to 20 sec Ramp-Up Rate 3°C/sec maximum Ramp-Down Rate –6°C/sec maximum Time 25°C to Peak Temperature 6 minutes maximum IR Reflow Soldering (Pb-Free Package) Peak Temperature 260°C (+0°C) Time at Peak Temperature 20 sec to 40 sec Ramp-Up Rate 3°C/sec maximum Ramp-Down Rate –6°C/sec maximum Time 25°C to Peak Temperature 8 minutes maximum 1 Values relate to package being used on a standard 2-layer PCB. This gives a worst case θJA and θJC. Refer to Figure 3 for a plot of maximum power dissipation vs. ambient temperature (TA). 2 TA = ambient temperature. 3 Junction-to-case resistance is applicable to components featuring a preferential flow direction, for example, components mounted on a heat sink. Junction-to-ambient resistance is more useful for air-cooled, PCB- mounted components. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. TEMPERATURE ( °C) 1.2 0.8 1.0 0.6 0.2 0.4 0 MAX PD = 3.4mW AT 150 °C Figure 3. MSOP Maximum Power Dissipation vs. Ambient Temperature ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degrada- tion or loss of functionality. |
Podobny numer części - ADT75ARZ-REEL7 |
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Podobny opis - ADT75ARZ-REEL7 |
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