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AD8224BCPZ-WP Arkusz danych(PDF) 9 Page - Analog Devices |
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AD8224BCPZ-WP Arkusz danych(HTML) 9 Page - Analog Devices |
9 / 27 page Preliminary Technical Data AD8224 ABSOLUTE MAXIMUM RATINGS Maximum Power Dissipation The maximum safe power dissipation for the AD8224 is limited by the associated rise in junction temperature (TJ) on the die. At approximately 130°C, which is the glass transition temperature, the plastic changes its properties. Even temporarily exceeding this temperature limit may change the stresses that the package exerts on the die, permanently shifting the parametric performance of the amplifiers. Exceeding a temperature of 130°C for an extended period can result in a loss of functionality. Figure 2 shows the maximum safe power dissipation in the package vs. the ambient temperature for the LFCSP on a 4-layer JEDEC standard board. 4.0 3.5 3.0 θJA = 48°C/W WHEN THERMAL PAD IS SOLDERED TO BOARD θJA = 86°C/W WHEN THERMAL PAD IS NOT SOLDERED TO BOARD 2.5 2.0 1.5 Table 8. Parameter Supply Voltage ±18 V Power Dissipation See Figure 2 Output Short Circuit Current Indefinite1 Input Voltage (Common Mode) ±Vs Differential Input Voltage ±Vs Storage Temperature −65°C to +130°C Operating Temperature Range2 −40°C to +125°C Lead Temperature Range (Soldering 10 sec) 300°C Junction Temperature 130°C Package Glass Transition Temperature 130°C ESD (Human Body Model) 4 kV ESD (Charge Device Model) 1 kV ESD (Machine Model) 0.4 kV 1Assumes the load is referenced to mid-supply. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute 1.0 maximum rating conditions may affect device reliability. 0.5 THERMAL RESISTANCE 0 Rating 2Temperature for specified performance is −40°C to +85°C. For performance to +125°C, see the Typical Performance Characteristics section. Table 9. –60 –40 –20 0 20 40 60 80 100 120 140 Thermal Pad θJA Unit Soldered to Board 48 °C/W Not Soldered to Board 86 °C/W AMBIENT TEMPERATURE (°C) Figure 2. Maximum Power Dissipation ESD CAUTION The θJA values in Table 9 assume a 4-layer JEDEC standard board. If the thermal pad is soldered to the board, then it is also assumed it is connected to a plane. θJC at the exposed pad is 4.4°C/W. Rev. PrB | Page 9 of 27 |
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