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ADA4411-3ARQZ-R7 Arkusz danych(PDF) 5 Page - Analog Devices |
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ADA4411-3ARQZ-R7 Arkusz danych(HTML) 5 Page - Analog Devices |
5 / 16 page ADA4411-3 Rev. 0 | Page 5 of 16 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating The power dissipated in the package (PD) is the sum of the quiescent power dissipation and the power dissipated in the package due to the load drive for all outputs. The quiescent power is the voltage between the supply pins (V Supply Voltage 12 V Power Dissipation See Figure 2 S ) times the quiescent current (I Storage Temperature –65°C to +125°C S ). The power dissipated due to load drive depends on the particular application. For each output, the power due to load drive is calculated by multiplying the load current by the associated voltage drop across the device. The power dissipated due to all of the loads is equal to the sum of the power dissipations due to each individual load. RMS voltages and currents must be used in these calculations. Operating Temperature Range –40°C to +85°C Lead Temperature Range (Soldering 10 sec) 300°C Junction Temperature 150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Airflow increases heat dissipation, effectively reducing θJA. In addition, more metal directly in contact with the package leads from metal traces, through-holes, ground, and power planes reduces the θ . JA THERMAL RESISTANCE Figure 2 shows the maximum safe power dissipation in the package vs. the ambient temperature for the 24-lead QSOP (83°C/W) on a JEDEC standard 4-layer board. θ θ is specified for the worst-case conditions, that is, θ JA JA is specified for device soldered in circuit board for surface-mount packages. JA values are approximations. Table 4. Thermal Resistance AMBIENT TEMPERATURE ( °C) –40 –20 0 20 40 60 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 2.5 80 Package Type θ Unit JA 24 Lead QSOP 83 °C/W Maximum Power Dissipation The maximum safe power dissipation in the ADA4411-3 package is limited by the associated rise in junction temperature (TJ) on the die. At approximately 150°C, which is the glass transition temperature, the plastic changes its properties. Even temporarily exceeding this temperature limit may change the stresses that the package exerts on the die, permanently shifting the parametric performance of the ADA4411-3. Exceeding a junction temperature of 150°C for an extended period can result in changes in the silicon devices potentially causing failure. Figure 2. Maximum Power Dissipation vs. Temperature for a 4-Layer Board ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. |
Podobny numer części - ADA4411-3ARQZ-R7 |
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Podobny opis - ADA4411-3ARQZ-R7 |
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