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ADA4860-1YRJZ-RL7 Arkusz danych(PDF) 5 Page - Analog Devices |
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ADA4860-1YRJZ-RL7 Arkusz danych(HTML) 5 Page - Analog Devices |
5 / 20 page ADA4860-1 Rev. 0 | Page 5 of 20 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating Supply Voltage 12.6 V Power Dissipation See Figure 3 Common-Mode Input Voltage −VS + 1 V to +VS − 1 V Differential Input Voltage ±VS Storage Temperature Range −65°C to +125°C Operating Temperature Range −40°C to +105°C Lead Temperature JEDEC J-STD-20 Junction Temperature 150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, θJA is specified for device soldered in circuit board for surface-mount packages. Table 4. Thermal Resistance Package Type θJA Unit 6-lead SOT-23 170 °C/W Maximum Power Dissipation The maximum safe power dissipation for the ADA4860-1 is limited by the associated rise in junction temperature (TJ) on the die. At approximately 150°C, which is the glass transition temperature, the plastic changes its properties. Even temporarily exceeding this temperature limit can change the stresses that the package exerts on the die, permanently shifting the parametric performance of the amplifiers. Exceeding a junction temperature of 150°C for an extended period can result in changes in silicon devices, potentially causing degradation or loss of functionality. The power dissipated in the package (PD) for a sine wave and a resistor load is the total power consumed from the supply minus the load power. PD = Total Power Consumed − Load Power ( ) L OUT CURRENT SUPPLY VOLTAGE SUPPLY D R V I V P 2 – × = RMS output voltages should be considered. Airflow across the ADA4860-1 helps remove heat from the package, effectively reducing θJA. In addition, more metal directly in contact with the package leads and through holes under the device reduces θJA. Figure 3 shows the maximum safe power dissipation in the package vs. the ambient temperature for the 6-lead SOT-23 (170°C/W) on a JEDEC standard 4-layer board. θJA values are approximations. 2.0 1.5 1.0 0.5 0 –40 –30 –20 –10 0 110 100 90 80 70 60 50 40 30 20 10 AMBIENT TEMPERATURE (°C) Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. |
Podobny numer części - ADA4860-1YRJZ-RL7 |
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Podobny opis - ADA4860-1YRJZ-RL7 |
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