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CD74HCT4511E Arkusz danych(PDF) 4 Page - Texas Instruments

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Numer części CD74HCT4511E
Szczegółowy opis  BCD-TO-7 SEGMENT LATCH/DECODER/DRIVERS
Download  17 Pages
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Producent  TI [Texas Instruments]
Strona internetowa  http://www.ti.com
Logo TI - Texas Instruments

CD74HCT4511E Arkusz danych(HTML) 4 Page - Texas Instruments

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CD54HC4511, CD74HC4511, CD74HCT4511
BCDTO7 SEGMENT LATCH/DECODER/DRIVERS
SCHS279D − DECEMBER 1998 − REVISED OCTOBER 2003
4
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Supply voltage range, VCC
−0.5 V to 7 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input diode current, IIK (VI < −0.5 V or VI > VCC + 0.5 V) ) (see Note 1)
±20 mA
. . . . . . . . . . . . . . . . . . . . . . . .
Output diode current, IOK (VO < −0.5 V or VO > VCC + 0.5V) (see Note 1)
±20 mA
. . . . . . . . . . . . . . . . . . . . . .
Continuous output source or sink current per output, IO (VO = 0 to VCC)
±25 mA
. . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND
±50 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance,
θJA (see Note 2): E package
67
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
M package
73
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package
108
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature (during soldering):
At distance 1/16
± 1/32 in (1.59 ± 0.79 mm) from case for 10 s maximum
265
°C
. . . . . . . . . . . . . . . . . . . . .
Unit inserted into a PC board (minimum thickness 1/16 in, 1.59 mm),
with solder contacting lead tips only
300
°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature, Tstg
−65 to 150
°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions for ’HC4511 (see Note 3)
TA = 25°C
TA = −55°C
TO 125
°C
TA = −40°C
TO 85
°C
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
UNIT
VCC
Supply voltage
2
6
2
6
2
6
V
VCC = 2 V
1.5
1.5
1.5
VIH
High-level input voltage
VCC = 4.5 V
3.15
3.15
3.15
V
VIH
High-level input voltage
VCC = 6 V
4.2
4.2
4.2
V
VCC = 2 V
0.5
0.5
0.5
VIL
Low-level input voltage
VCC = 4.5 V
1.35
1.35
1.35
V
VIL
Low-level input voltage
VCC = 6 V
1.8
1.8
1.8
V
VI
Input voltage
0
VCC
0
VCC
0
VCC
V
VO
Output voltage
0
VCC
0
VCC
0
VCC
V
VCC = 2 V
1000
1000
1000
tt
Input transition (rise and fall) time
VCC = 4.5 V
500
500
500
ns
tt
Input transition (rise and fall) time
VCC = 6 V
400
400
400
ns
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.


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