apply over the full Operating Junction Temperature (T

design, or statistical correlation. Typical values represent the most likely parametric norm at T

reference purposes only. Unless otherwise stated the following conditions apply: V

Ω. See (Note

5). (Continued)

Symbol

Parameter

Conditions

Min

Typ

Max

Units

FB bias current

1

nA

Thermal Shutdown

T

SD

Thermal shutdown

temperature

175

˚C

Thermal shutdown hysteresis

20

˚C

Thermal Resistance

θ

JA

Junction to Ambient

0 LFPM Air Flow

LLP Package

33

˚C/W

TSSOP Package

40

θ

JC

Junction to Case

LLP Package

8.8

˚C/W

TSSOP Package

5.2

Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device

is intended to be functional. For guaranteed specifications and test conditions, see the Electrical Characteristics.

Note 2: The human body model is a 100pF capacitor discharged through a 1.5k

Ω resistor into each pin.

Note 4: For detailed information on soldering plastic TSSOP and LLP packages, refer to the Packaging Data Book available from National Semiconductor

Corporation.

Note 5: Typical specifications represent the most likely parametric norm at 25˚C operation.

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