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NanoFree™ Placement and Removal Procedures

Placement

Removal

THS7318

SLOS517A – JANUARY 2007 – REVISED FEBRUARY 2007

PACKAGING/ORDERING INFORMATION

TRANSPORT MEDIA,

PACKAGED DEVICES

PART CODE

QUANTITY

THS7318YZFT

Tape and Reel, 250

Wafer Scale 9-pin

BYR

THS7318YZFR

Tape and Reel, 3000

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

Web site at www.ti.com.

These procedures are generic guidelines to rework NanoFree™ packages assembled on a 0.056-inch thick FR4

board. It’s recommended to modify heating profiles for different board thicknesses and equipment used. The

assembly process recommended below should be used with a new device. Do not reuse the part after it is

removed.

(convection) rework equipment DRS-24NC. The NMX090DVG nozzle is recommended for use with the YZF

package. Customers can use other comparable hot gas (convection) equipment and tooling.

1. Apply flux paste to component

2. Align device over pads

3. Place device on board. Care must be taken to prevent over-travel during placement which may damage

the part or vacuum tip.

4. Raise nozzle 0.05"

5. Preheat board to 90

°C, nozzle warming up 20% air flow, 125°C

6. Soak Stage—20% air flow, 225

°C, 90 seconds

7. Ramp Stage—20% air flow, 335

°C, 30 seconds

8. Reflow Stage—25% air flow, 370

°C, 65 seconds

9. Cool down Stage—40% air flow, 25

°C, 50 seconds

1. Apply flux paste to component

2. Align Nozzle over part to be removed

3. Maintain nozzle 0.050"over device. Care must be taken to prevent over-travel of the vacuum tip which

may damage the part or vacuum tip when measuring this distance.

4. Preheat board to 90

°C, nozzle warming up 20% air flow, 125°C

5. Soak Stage—20% air flow, 225

°C, 90 seconds

6. Ramp Stage—20% air flow, 335

°C, 30 seconds

7. Reflow Stage—25% air flow, 370

°C, 65 seconds

8. Enable Vacuum at the end of the reflow cycle, lower vacuum nozzle, and remove part

9. Cool down Stage—40% air flow, 25

°C, 50 seconds

10. Turn off the vacuum and remove part from nozzle.

11. Care should be used if the device is to be returned to TI for failure analysis. Using any metal tweezers or

rough handling can damage the part, and render it un-analyzable.

3

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