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MC10EL52DR2G Arkusz danych(PDF) 2 Page - ON Semiconductor

Numer części MC10EL52DR2G
Szczegółowy opis  5V ECL Differential Data and Clock D Flip-Flop
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Producent  ONSEMI [ON Semiconductor]
Strona internetowa  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

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MC10EL52, MC100EL52
http://onsemi.com
2
Figure 1. Logic Diagram and Pinout Assignment
1
2
3
45
6
7
8
Q
VEE
VCC
D
Q
CLK
CLK
D
D
Table 1. TRUTH TABLE
D*
L
H
CLK*
Z
Z
Q
L
H
Z = LOW to HIGH Transition
D, D
ECL Data Input
CLK, CLK
ECL Clock Input
Q, Q
ECL Data Output
VCC
Positive Supply
VEE
Negative Supply
Table 2. PIN DESCRIPTION
PIN
FUNCTION
* Pin will default low when left open.
EP
Exposed pad must be connected
to a sufficient thermal conduit.
Electrically connect to the most
negative supply or leave floating
open.
Table 3. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
PECL Mode Power Supply
VEE = 0 V
8
V
VEE
NECL Mode Power Supply
VCC = 0 V
−8
V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
VI  VCC
VI  VEE
6
−6
V
V
Iout
Output Current
Continuous
Surge
50
100
mA
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
8 SOIC
8 SOIC
190
130
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
8 SOIC
41 to 44
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
8 TSSOP
8 TSSOP
185
140
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
8 TSSOP
41 to 44 ± 5%
°C/W
Tsol
Wave Solder
Pb
Pb−Free
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
265
265
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.


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