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MC10EP56 Arkusz danych(PDF) 3 Page - ON Semiconductor

Numer części MC10EP56
Szczegółowy opis  3.3V / 5V ECL Dual Differential 2:1 Multiplexer
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Producent  ONSEMI [ON Semiconductor]
Strona internetowa  http://www.onsemi.com
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MC10EP56 Arkusz danych(HTML) 3 Page - ON Semiconductor

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MC10EP56, MC100EP56
http://onsemi.com
3
Table 3. ATTRIBUTES
Characteristics
Value
Value
Internal Input Pulldown Resistor
75 kW
Internal Input Pullup Resistor
N/A
ESD Protection
Human Body Model
Machine Model
Charged Device Model
> 2 kV
> 150 V
> 2 kV
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
Pb Pkg
Pb−Free Pk
SOIC
TSSOP
QFN
Level 1
Level 1
N/A
Level 3
Level 3
Level 1
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Transistor Count
140 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Table 4. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
PECL Mode Power Supply
VEE = 0 V
6
V
VEE
NECL Mode Power Supply
VCC = 0 V
−6
V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
VI  VCC
VI  VEE
6
−6
V
V
Iout
Output Current
Continuous
Surge
50
100
mA
mA
IBB
VBB Sink/Source
± 0.5
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient) 0 lfpm
500 lfpm
20 TSSOP
20 TSSOP
140
100
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
20 TSSOP
23 to 41
°C/W
qJA
Thermal Resistance (Junction−to−Ambient) 0 lfpm
500 lfpm
20 SOIC
20 SOIC
90
60
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
20 SOIC
33 to 35
°C/W
qJA
Thermal Resistance (Junction−to−Ambient) 0 lfpm
500 lfpm
QFN−20
QFN−20
47
33
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
QFN−20
18
°C/W
Tsol
Wave Solder
Pb
Pb−Free
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
265
265
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.


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