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MC100EP139DWR2 Arkusz danych(PDF) 4 Page - ON Semiconductor

Numer części MC100EP139DWR2
Szczegółowy opis  3.3V / 5V ECL 첨2/4, 첨4/5/6 Clock Generation Chip
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Producent  ONSEMI [ON Semiconductor]
Strona internetowa  http://www.onsemi.com
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MC100EP139DWR2 Arkusz danych(HTML) 4 Page - ON Semiconductor

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MC10EP139, MC100EP139
http://onsemi.com
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Table 3. ATTRIBUTES
Characteristics
Value
Internal Input Pulldown Resistor
75 kW
Internal Input Pullup Resistor
N/A
ESD Protection
Human Body Model
Machine Model
Charged Device Model
> 2 kV
> 100 V
> 2 kV
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
Pb Pkg
Pb−Free Pkg
SOIC−20
TSSOP−20
QFN−20
Level 1
Level 1
N/A
Level 3
Level 1
Level
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Transistor Count
758 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Table 4. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
PECL Mode Power Supply
VEE = 0 V
6
V
VEE
NECL Mode Power Supply
VCC = 0 V
−6
V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
VI v VCC
VI w VEE
6
−6
V
V
Iout
Output Current
Continuous
Surge
50
100
mA
mA
IBB
VBB Sink/Source
± 0.5
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient) 0 lfpm
500 lfpm
TSSOP−20
TSSOP−20
140
100
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
TSSOP−20
23 to 41
°C/W
qJA
Thermal Resistance (Junction−to−Ambient) 0 lfpm
500 lfpm
SOIC−20
SOIC−20
90
60
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
SOIC−20
33 to 35
°C/W
qJA
Thermal Resistance (Junction−to−Ambient) 0 lfpm
500 lfpm
QFN−20
QFN−20
90
60
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
QFN−20
33 to 35
°C/W
Tsol
Wave Solder
Pb
Pb−Free
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
265
265
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.


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