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BY228 Arkusz danych(PDF) 3 Page - NXP Semiconductors |
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BY228 Arkusz danych(HTML) 3 Page - NXP Semiconductors |
3 / 7 page 1996 Sep 26 3 Philips Semiconductors Product specification Damper diode BY228 THERMAL CHARACTERISTICS Note 1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥40 µm, see Fig.4. For more information please refer to the “General Part of associated Handbook”. SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth j-tp thermal resistance from junction to tie-point lead length = 10 mm 25 K/W Rth j-a thermal resistance from junction to ambient note 1 75 K/W mounted as shown in Fig.5 40 K/W |
Podobny numer części - BY228 |
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Podobny opis - BY228 |
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