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FAN2106EMPX Arkusz danych(PDF) 4 Page - Fairchild Semiconductor |
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FAN2106EMPX Arkusz danych(HTML) 4 Page - Fairchild Semiconductor |
4 / 14 page © 2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN2106 Rev. 1.0.1 4 Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Parameter Conditions Min. Max. Unit PVIN to PGND 28 V VCC to AGND AGND = PGND 6 V BOOT to PGND 35 V BOOT to SW -0.3 6 V Continuous -0.5 24 V SW to PGND Transient (t < 20nsec, F < 600KHz) -5 30 V All other pins -0.3 VCC+0.3 V Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings. Symbol Parameter Conditions Min. Typ. Max. Unit VCC Bias Voltage VCC to AGND 4.5 5.0 5.5 V VIN Supply Voltage PVIN to PGND 3 24 V FAN2106M -10 85 °C TA Ambient Temperature FAN2106EM -40 85 °C TJ Junction Temperature 125 °C Thermal Information Symbol Parameter Min. Typ. Max. Unit TSTG Storage Temperature -65 150 °C TL Lead Soldering Temperature, 10 seconds 300 °C TVP Vapor Phase, 60 seconds 215 °C TI Infrared, 15 seconds 220 °C P1 (Q2) 4 °C/W P2 (Q1) 7 °C/W θJC Thermal Resistance: Junction-to-Case P3 4 °C/W θJ-PCB Thermal Resistance: Junction-to-Mounting Surface 35 (1) °C/W PD Power Dissipation, TA = 25°C 2.8 (1) W Note: 1. Typical thermal resistance when mounted on a four-layer, two-ounce PCB, as shown in Figure 25. Actual results are dependent on mounting method and surface related to the design. |
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