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AM29LV400BT-90DWE1 Arkusz danych(PDF) 10 Page - Advanced Micro Devices |
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AM29LV400BT-90DWE1 Arkusz danych(HTML) 10 Page - Advanced Micro Devices |
10 / 14 page 8 Am29LV400B Known Good Die SU PP L E ME NT PRODUCT TEST FLOW Figure 1 provides an overview of AMD’s Known Good Die test flow. For more detailed information, refer to the Am29LV400B product qualification database supple- ment for KGD. AMD implements quality assurance pro- cedures throughout the product test flow. In addition, an off-line quality monitoring program (QMP) further guarantees AMD quality standards are met on Known Good Die products. These QA procedures also allow AMD to produce KGD products without requiring or implementing burn-in. Figure 1. AMD KGD Product Test Flow Wafer Sort 1 Bake 24 hours at 250 °C Wafer Sort 2 Wafer Sort 3 High Temperature Packaging for Shipment Shipment DC Parameters Functionality Programmability Erasability Data Retention DC Parameters Functionality Programmability Erasability DC Parameters Functionality Programmability Erasability Speed Incoming Inspection Wafer Saw Die Separation 100% Visual Inspection Die Pack |
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Podobny opis - AM29LV400BT-90DWE1 |
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