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Zakładka z wyszukiwarką danych komponentów |
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Zakładka z wyszukiwarką danych komponentów |
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IRF634NPBF Arkusz danych(PDF) 1 Page - International Rectifier |
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IRF634NPBF Arkusz danych(HTML) 1 Page - International Rectifier |
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1 / 11 page  Parameter Max. Units ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 8.0 ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 5.6 A IDM Pulsed Drain Current 32 PD @TC = 25°C Power Dissipation 88 W PD @TA = 25°C Power Dissipation 3.8 Linear Derating Factor 0.59 W/°C VGS Gate-to-Source Voltage ± 20 V EAS Single Pulse Avalanche Energy 110 mJ IAR Avalanche Current 4.8 A EAR Repetitive Avalanche Energy 8.8 mJ dv/dt Peak Diode Recovery dv/dt 7.3 V/ns TJ Operating Junction and -55 to +175 TSTG Storage Temperature Range Soldering Temperature, for 10 seconds 300 (1.6mm from case ) °C Mounting torque, 6-32 or M3 srew 10 lbf•in (1.1N•m) HEXFET® Power MOSFET 05/28/04 Absolute Maximum Ratings Description VDSS = 250V RDS(on) = 0.435Ω ID = 8.0A S D G l Advanced Process Technology l Dynamic dv/dt Rating l 175°C Operating Temperature l Fast Switching l Fully Avalanche Rated l Ease of Paralleling l Simple Drive Requirements l Lead-Free D2Pak IRF634NS TO-220AB IRF634N TO-262 IRF634NL IRF634NPbF IRF634NSPbF IRF634NLPbF Fifth Generation HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. The TO-220 package is universally preferred for all commercial- industrial applications at power dissipation levels to approximately 50 watts. The low thermal resistance and low package cost of the TO-220 contribute to its wide acceptance throughout the industry. The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application. The through-hole version (IRF634NL) is available for low- profile application. www.irf.com 1 PD - 95342 |
Podobny numer części - IRF634NPBF |
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Podobny opis - IRF634NPBF |
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