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M93C-76WDS3TG Arkusz danych(PDF) 5 Page - STMicroelectronics |
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M93C-76WDS3TG Arkusz danych(HTML) 5 Page - STMicroelectronics |
5 / 31 page 5/31 M93C86, M93C76, M93C66, M93C56, M93C46 Data Output (Q) when Chip Select Input (S) is driv- en High. An internal Power-on Data Protection mechanism in the M93Cx6 inhibits the device when the supply is too low. Figure 3. DIP, SO, TSSOP and MLP Connections (Top View) Note: 1. See PACKAGE MECHANICAL section for package di- mensions, and how to identify pin-1. 2. DU = Don’t Use. The DU (Don’t Use) pin does not contribute to the normal operation of the device. It is reserved for use by STMicroelectronics during test sequences. The pin may be left unconnected or may be con- nected to VCC or VSS. Direct connection of DU to VSS is recommended for the lowest stand-by pow- er consumption. VSS Q ORG DU C SVCC D AI01929B M93Cx6 1 2 3 4 8 7 6 5 |
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