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HLMP-AB86 Arkusz danych(PDF) 9 Page - AVAGO TECHNOLOGIES LIMITED

Numer części HLMP-AB86
Szczegółowy opis  Precision Optical Performance Red, Green and Blue 5mm Mini Oval LEDs
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Producent  AVAGO [AVAGO TECHNOLOGIES LIMITED]
Strona internetowa  http://www.avagotech.com
Logo AVAGO - AVAGO TECHNOLOGIES LIMITED

HLMP-AB86 Arkusz danych(HTML) 9 Page - AVAGO TECHNOLOGIES LIMITED

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Precautions:
Lead Forming:
• TheleadsofanLEDlampmaybepreformedorcutto
lengthpriortoinsertionandsolderingonPCboard.
• Forbettercontrol,itisrecommendedtousepropertool
topreciselyformandcuttheleadstoapplicablelength
ratherthandoingitmanually.
• Ifmanualleadcuttingisnecessary,cuttheleadsafter
thesolderingprocess.Thesolderconnectionformsa
mechanicalgroundwhichpreventsmechanicalstress
duetoleadcuttingfromtravelingintoLEDpackage.
Thisishighlyrecommendedforhandsolderoperation,
astheexcessleadlengthalsoactsassmallheatsink.
Soldering and Handling:
• CaremustbetakenduringPC�assemblyandsoldering
processtopreventdamagetotheLEDcomponent.
• LEDcomponentmaybeeffectivelyhandsolderedto
PC�.However,itisonlyrecommendedunderunavoid-
ablecircumstancessuchasrework.Theclosestmanual
soldering distance of the soldering heat source (sol-
deringiron’stip)tothebodyis1.�9mm.Solderingthe
LEDusingsolderingirontipcloserthan1.�9mmmight
damagetheLED.
��ote:
1. PC� with different size and design (component density) will have
differentheatmass(heatcapacity).Thismightcauseachangeintem-
peratureexperiencedbytheboardifsamewavesolderingsettingis
used.So,itisrecommendedtore-calibratethesolderingprofileagain
beforeloadinganewtypeofPC�.
�. AvagoTechnologies’highbrightnessLEDareusinghighefficiency
LEDdiewithsinglewirebondasshownbelow.Customerisadvised
to take extra precaution during wave soldering to ensure that the
maximumwavetemperaturedoesnotexceed��0°Candthesolder
contacttimedoesnotexceeding3sec.Over-stressingtheLEDduring
solderingprocessmightcauseprematurefailuretotheLEDdueto
delamination.
Avago Technologies LED configuration
1.�9mm
• ESDprecautionmustbeproperlyappliedonthesolder-
ingstationandpersonneltopreventESDdamagetothe
LEDcomponentthatisESDsensitive.DorefertoAvago
applicationnoteA��11��fordetails.Thesolderingiron
usedshouldhavegroundedtiptoensureelectrostatic
chargeisproperlygrounded.
• Recommendedsolderingcondition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heat temperat�re
105 °C Max.
-
Preheat time
60 sec Max
-
Peak temperat�re
250 °C Max.
260 °C Max.
�well time
3 sec Max.
5 sec Max
��ote:
1) Aboveconditionsreferstomeasurementwiththermocouplemounted
atthebottomofPC�.
�) Itisrecommendedtouseonlybottompreheatersinordertoreduce
thermalstressexperiencedbyLED.
• Wavesolderingparametersmustbesetandmaintained
accordingtotherecommendedtemperatureanddwell
time.Customerisadvisedtoperformdailycheckonthe
solderingprofiletoensurethatitisalwaysconforming
torecommendedsolderingconditions.
��ote:ElectricalconnectionbetweenbottomsurfaceofLEDdieand
theleadframeisachievedthroughconductivepaste.
• Anyalignmentfixturethatisbeingappliedduringwave
solderingshouldbelooselyfittedandshouldnotapply
weightorforceonLED.��onmetalmaterialisrecom-
mendedasitwillabsorblessheatduringwavesolder-
ingprocess.
• At elevated temperature, LED is more susceptible to
mechanicalstress.Therefore,PC�mustallowedtocool
down to room temperature prior to handling, which
includesremovalofalignmentfixtureorpallet.
• IfPC�boardcontainsboththroughhole(TH)LEDand
othersurfacemountcomponents,itisrecommended
thatsurfacemountcomponentsbesolderedonthetop
sideofthePC�.Ifsurfacemountneedtobeonthebot-
tomside,thesecomponentsshouldbesolderedusing
reflowsolderingpriortoinsertiontheTHLED.
• Recommended PC board plated through holes (PTH)
sizeforLEDcomponentleads.
LED component
lead size
Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
• Over-sizingthePTHcanleadtotwistedLEDafterclinch-
ing.OntheotherhandundersizingthePTHcancause
difficultyinsertingtheTHLED.
CATHODE
ANODE
AlInGaP Device
InGaN Device


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