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STPS1L20MF Arkusz danych(PDF) 5 Page - STMicroelectronics |
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STPS1L20MF Arkusz danych(HTML) 5 Page - STMicroelectronics |
5 / 7 page STPS1L20MF Package information 5/7 2 Package information Figure 12. STmite flat recommended footprint (all dimensions in mm) In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 4. STmite flat dimensions Ref. Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.80 0.85 0.95 0.031 0.033 0.037 b 0.40 0.55 0.65 0.016 0.022 0.026 b2 0.70 0.85 1.00 0.027 0.033 0.039 c 0.10 0.15 0.25 0.004 0.006 0.009 D 1.75 1.90 2.05 0.069 0.075 0.081 E 3.60 3.80 3.90 0.142 0.150 0.154 E1 2.80 2.95 3.10 0.110 0.116 0.122 L 0.50 0.55 0.80 0.020 0.022 0.031 L1 2.10 2.40 2.60 0.083 0.094 0.102 L2 0.45 0.60 0.75 0.018 0.024 0.030 L3 0.20 0.35 0.50 0.008 0.014 0.020 E1 E c Db L3 A L L1 L2 b2 0.85 0.63 2.00 4.13 0.95 1.95 0.65 0.65 |
Podobny numer części - STPS1L20MF |
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Podobny opis - STPS1L20MF |
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