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STCS1PHR Arkusz danych(PDF) 11 Page - STMicroelectronics |
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STCS1PHR Arkusz danych(HTML) 11 Page - STMicroelectronics |
11 / 17 page STCS1 Application information 11/17 – Package: DFN8 3x3 mm; –TA = 50°C; In this case VDRAIN = 12 - 3 x 3.6 = 1.2 V PD = (1.2 - 0.1) x 0.5 + 12 x 0.5 x 10 -3 = 0.55 + 6 x 10-3 = 556 mW The junction temperature will be: TJ = 37.6 x 0.556 + 50 = 70.9°C. The following pictures show the maximum power dissipation according to the ambient temperature for both packages: Figure 12. Maximum power dissipation vs TA for DFN8 3x3mm Figure 13. Maximum power dissipation vs TA for PowerSO-8 0.00 0.50 1.00 1.50 2.00 2.50 25 35 45 55 65 75 85 [°C] 0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 1.80 2.00 25 35 45 55 65 75 85 [°C] |
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