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MC100ES6254 Arkusz danych(PDF) 4 Page - Integrated Device Technology |
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4 / 9 page MC100ES6254/D 4 TIMING SOLUTIONS a. Output termination voltage VTT=0 V for VCC=2.5 V operation is supported but the power consumption of the device will increase. b. Operating junction temperature impacts device life time. Maximum continuous operating junction temperature should be selected according to the application life time requirements (See application note AN1545 and the application section in this data sheet for more information). The device AC and DC parameters are specified up to 110 °C junction temperature allowing the MC100ES6254 to be used in applications requiring industrial temperature range. It is recommended that users of the MC100ES6254 employ thermal modeling analysis to assist in applying the junction temperature specifications to their particular application. a. Input have internal pullup/pulldown resistors that affect the input current. b. VPP is the minimum differential input voltage swing required to maintain AC characteristic. c. VCMR (DC) is the crosspoint of the differential input signal. Functional operation is obtained when the crosspoint is within the VCMR (DC) range and the input swing lies within the VPP (DC) specification. d. Equivalent to a termination 50 Ω to V TT. e. ICC calculation: ICC = (number of differential output pairs used) * (IOH + IOL) + IGND ICC = (number of differential output pairs used) * (VOH-VTT)÷Rload +(VOL-VTT)÷Rload) + IGND Table 5. GENERAL SPECIFICATIONS Symbol Characteristics Min Typ Max Unit Condition VTT Output termination voltage VCC - 2 a V MM ESD Protection (Machine model) 200 V HBM ESD Protection (Human body model) 2000 V CDM ESD Protection (Charged device model) 1500 V LU Latch-up immunity 200 mA CIN 4.0 pF Inputs θ JA Thermal resistance junction to ambient JESD 51-3, single layer test board JESD 51-6, 2S2P multilayer test board 83.1 73.3 68.9 63.8 57.4 59.0 54.4 52.5 50.4 47.8 86.0 75.4 70.9 65.3 59.6 60.6 55.7 53.8 51.5 48.8 °C/W °C/W °C/W °C/W °C/W °C/W °C/W °C/W °C/W °C/W Natural convection 100 ft/min 200 ft/min 400 ft/min 800 ft/min Natural convection 100 ft/min 200 ft/min 400 ft/min 800 ft/min θ JC Thermal resistance junction to case 23.0 26.3 °C/W MIL-SPEC 883E Method 1012.1 Operating junction temperatureb (continuous operation) MTBF = 9.1 years 110 °C TFunc Functional temperature range TA=-40 TJ=+110 °C Table 6. DC CHARACTERISTICS (VCC = 3.3 V ± 5% or 2.5 V ± 5%, TJ = 0° to +110°C) Symbol Characteristics Min Typ Max Unit Condition LVCMOS control inputs (OEA, OEB, SEL0, SEL1) VIL Input voltage low 0.8 V VIH Input voltage high 2.0 V IIN Input Currenta ±100 µAV IN=VCC or VIN=GND LVPECL clock inputs (CLK0, CLK0, CLK1, CLK1) VPP AC differential input voltageb 0.1 1.3 V Differential operation VCMR Differential cross point voltagec 1.0 VCC-0.3 V Differential operation LVPECL clock outputs (QA0-2, QA0-2, QB0-2, QB0-2) VOH Output High Voltage VCC-1.2 VCC-1.005 VCC-0.7 V IOH = -30 mA d VOL Output Low Voltage VCC=3.3 V ±5% VCC=2.5 V ±5% VCC-1.9 VCC-1.9 VCC-1.705 VCC-1.705 VCC-1.5 VCC-1.3 VIOL = -5 mA e IGND Maximum Quiescent Supply Current without output termination current 52 85 mA GND pin Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com MC100ES6254 2.5/3.3V Differential LVPECL 2x2 Clock Switch and Fanout Buffer NETCOM IDT™ 2.5/3.3V Differential LVPECL 2x2 Clock Switch and Fanout Buffer Freescale Timing Solutions Organization has been acquired by Integrated Device Technology, Inc MC100ES6254 4 |
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