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AD824 Arkusz danych(PDF) 5 Page - Analog Devices |
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AD824 Arkusz danych(HTML) 5 Page - Analog Devices |
5 / 16 page REV. C AD824 –5– WAFER TEST LIMITS Parameter Symbol Conditions Limit Unit Offset Voltage VOS 1.0 mV max Input Bias Current IB 12 pA max Input Offset Current IOS 20 pA Input Voltage Range VCM –0.2 to 3.0 V min Common-Mode Rejection Ratio CMRR VCM = 0 V to 2 V 66 dB min Power Supply Rejection Ratio PSRR V = + 2.7 V to +12 V 70 mV/V Large Signal Voltage Gain AVO RL = 2 k W 15 V/mV min Output Voltage High VOH ISOURCE = 20 mA 4.975 V min Output Voltage Low VOL ISINK = 20 mA25 mV max Supply Current/Amplifier ISY VO = 0 V, RL = • 600 mA max NOTE Electrical tests and wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed for standard product dice. Consult factory to negotiate specifications based on dice lot qualifications through sample lot assembly and testing. (@ VS = 5.0 V, VCM = 0 V, TA = 25 C unless otherwise noted) ABSOLUTE MAXIMUM RATINGS 1 Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±18 V Input Voltage . . . . . . . . . . . . . . . . . . . . . . . –VS – 0.2 V to +VS Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . ±30 V Output Short Circuit Duration to GND . . . . . . . . . Indefinite Storage Temperature Range R-14, R-16 Packages . . . . . . . . . . . . . . . . –65 ∞C to +150∞C Operating Temperature Range AD824A . . . . . . . . . . . . . . . . . . . . . . . . . . . –40 ∞C to +85∞C Junction Temperature Range R-14, R-16 Packages . . . . . . . . . . . . . . . . –65 ∞C to +150∞C Lead Temperature Range (Soldering 60 sec) . . . . . . . . . 300 ∞C Package Type qJA2 qJC Unit 14-Lead SOIC (R) 120 36 ∞C/W 16-Lead SOIC (R) 92 27 ∞C/W NOTES 1 Absolute maximum ratings apply to packaged parts unless otherwise noted. 2 qJA is specified for the worst case conditions, i.e., qJAis specified for device in socket for P-DIP packages; qJA is specified for device soldered in circuit board for SOIC package. ORDERING GUIDE Temperature Package Package Model Range Description Option AD824AR-14 –40 ∞C to +85∞C 14-Pin SOIC R-14 AD824AR-14-3V –40 ∞C to +85∞C 14-Pin SOIC R-14 AD824AR-16 –40 ∞C to +85∞C 16-Pin SOIC R-16 R1 R2 +IN J1 J2 R13 –IN R15 Q4 Q5 Q6 R9 I5 VCC C3 Q7 C2 Q22 Q19 Q21 Q27 Q18 Q29 Q20 Q23 R7 C4 VOUT Q24 Q25 Q31 Q28 R17 Q26 C1 I4 I3 I2 I1 R12 R14 Q2 Q8 Q3 VEE I6 Figure 1. Simplified Schematic of 1/4 AD824 CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD824 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE |
Podobny numer części - AD824_03 |
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Podobny opis - AD824_03 |
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