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AD8565AKS-REEL7 Arkusz danych(PDF) 10 Page - Analog Devices

Numer części AD8565AKS-REEL7
Szczegółowy opis  16 V Rail-to-Rail Operational Amplifiers
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Strona internetowa  http://www.analog.com
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AD8565AKS-REEL7 Arkusz danych(HTML) 10 Page - Analog Devices

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AD8565/AD8566/AD8567
Rev. D | Page 10 of 16
This input current is not inherently damaging to the device as
long as it is limited to 5 mA or less. If a condition exists using
the AD856x where the input exceeds the supply more than
0.6 V, an external series resistor should be added. The size of the
resistor can be calculated by using the maximum overvoltage
divided by 5 mA. This resistance should be placed in series with
either input exposed to an overvoltage.
OUTPUT PHASE REVERSAL
The AD856x family is immune to phase reversal. Although the
device’s output does not change phase, large currents due to
input overvoltage could damage the device. In applications
where the possibility of an input voltage exceeding the supply
voltage exists, overvoltage protection should be used as
described in the Input Overvoltage Protection section.
POWER DISSIPATION
The maximum allowable internal junction temperature of
150°C limits the AD856x family’s maximum power dissipation
of AD856x devices. As the ambient temperature increases, the
maximum power dissipated by AD856x devices must decrease
linearly to maintain the maximum junction temperature. If this
maximum junction temperature is exceeded momentarily, the
device still operates properly once the junction temperature is
reduced below 150°C. If the maximum junction temperature is
exceeded for an extended period, overheating could lead to
permanent damage of the device.
The maximum safe junction temperature, TJMAX, is 150°C. Using
the following formula, the maximum power that an AD856x
device can safely dissipate as a function of temperature can be
obtained:
PDISS = TJMAX − TAJA
where:
PDISS is the AD856x power dissipation.
TJMAX is the AD856x maximum allowable junction temperature
(150°C).
TA is the ambient temperature of the circuit.
θJA is the AD856x package thermal resistance, junction-to-ambient.
The power dissipated by the device can be calculated as
PDISS = (VS − VOUT) × ILOAD
where:
VS is the supply voltage.
VOUT is the output voltage.
ILOAD is the output load current.
Figure 30 shows the maximum power dissipation vs.
temperature. To achieve proper operation, use the previous
equation to calculate PDISS for a specific package at any given
temperature or use Figure 30.
AMBIENT TEMPERATURE (°C)
1.25
0.75
0
–35
0.50
0.25
1.00
–15
5
25
45
65
85
14-LEAD SOIC
5-LEAD SOT-23
8-LEAD MSOP
14-LEAD TSSOP
Figure 30. Maximum Power Dissipation vs. Temperature
for 5-Lead SC70, 8-Lead MSOP, and 14-Lead TSSOP/SOIC Packages
THERMAL PAD—AD8567
The AD8567 LFCSP comes with a thermal pad that is attached
to the substrate. This substrate is connected to VDD. To be
electrically safe, the thermal pad should be soldered to an area
on the board that is electrically isolated or connected to VDD.
Attaching the thermal pad to ground adversely affects the
performance of the part.
Soldering down this thermal pad dramatically improves the
heat dissipation of the package. It is necessary to attach vias that
connect the soldered thermal pad to another layer on the board.
This provides an avenue to dissipate the heat away from the
part. Without vias, the heat is isolated directly under the part.


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