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OP250GP Arkusz danych(PDF) 4 Page - Analog Devices |
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OP250GP Arkusz danych(HTML) 4 Page - Analog Devices |
4 / 5 page OP150/OP250/OP450 This information applies to a product under development. Its characteristics and specifications are subject to change without notice. Analog Devices assumes no obligation regarding future manufacture unless otherwise agreed to in writing. REV. 0 PRELIMINARY TECHNICAL DATA –4– WARNING! ESD SENSITIVE DEVICE CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the OP150/OP250/OP450 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, p roper ESD precautions are recommended to avoid performance degradation or loss of functionality. WAFER TEST LIMITS Parameter Symbol Conditions Limit Units Offset Voltage VOS ±10 mV max Input Bias Current IB 50 pA max Input Offset Current IOS 10 pA max Input Voltage Range VCM V– to V+ V min Common-Mode Rejection Ratio CMRR VCM = 0 V to 10 V 60 dB min Power Supply Rejection Ratio PSRR V = +2.7 V to +7 V 70 dB min Large Signal Voltage Gain AVO RL = 10 k Ω V/mV min Output Voltage High VOH RL = 2 kΩ to GND 2.9 V min Output Voltage Low VOL RL = 2 k Ω to V+ 55 mV max Supply Current/Amplifier ISY VO = 0 V, RL = ∞ 650 µA max NOTE Electrical tests and wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed for standard product dice. Consult factory to negotiate specifications based on dice lot qualifications through sample lot assembly and testing. (@ VS = +5.0 V, VCM = 0 V, TA = +25 C unless otherwise noted.) ABSOLUTE MAXIMUM RATINGS 1 Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+7 V Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND to VS Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V Output Short-Circuit Duration to GND 2 . . . . . . . . . Indefinite Storage Temperature Range P, S, RT, RU Package . . . . . . . . . . . . . . . . –65 °C to +150°C Operating Temperature Range OP150/OP250/OP450G . . . . . . . . . . . . . . . –40 °C to +125°C Junction Temperature Range P, S, RT, RU Package . . . . . . . . . . . . . . . . –65 °C to +150°C Lead Temperature Range (Soldering, 60 sec) . . . . . . . +300 °C Package Type θ JA 3 θ JC Units 5-Pin SOT (RT) 325 °C/W 8-Pin Plastic DIP (P) 103 43 °C/W 8-Pin SOIC (S) 158 43 °C/W 8-Pin TSSOP (RU) 240 43 °C/W 14-Pin Plastic DIP (P) 76 33 °C/W 14-Pin SOIC (S) 120 36 °C/W 14-Pin TSSOP( RU) 180 35 °C/W NOTES 1Absolute maximum ratings apply to both DICE and packaged parts, unless otherwise noted. 2 θ JA is specified for the worst case conditions, i.e., θJA is specified for device in socket for P-DIP packages; θ JA is specified for device soldered in circuit board for SOIC package. ORDERING GUIDE Temperature Model Range Package Option OP150GS –40 °C to +125°C 8-Pin SOIC OP150GRT –40 °C to +125°C 5-Pin SOT OP150GBC +25 °C DICE OP250GP –40 °C to +125°C 8-Pin Plastic DIP OP250GS –40 °C to +125°C 8-Pin SOIC OP250GRU –40 °C to +125°C 8-Pin TSSOP OP250GBC +25 °C DICE OP450GP –40 °C to +125°C 14-Pin Plastic DIP OP450GS –40 °C to +125°C 14-Pin SOIC OP450GRU –40 °C to +125°C 14-Pin TSSOP OP450GBC +25 °C DICE OBSOLETE |
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