74LVT16500DGGRE4 datasheet(4/14 Pages) TI

Numer części	74LVT16500DGGRE4

Szczegółowy opis	3.3-V ABT 18-BIT UNIVERSAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS

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Producent	TI [Texas Instruments]

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SN54LVT16500, SN74LVT16500

3.3-V ABT 18-BIT UNIVERSAL BUS TRANSCEIVERS

WITH 3-STATE OUTPUTS

SCBS146D – MAY 1992 – REVISED NOVEMBER 1996

4

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

logic diagram (positive logic)

1D

C1

CLK

1D

C1

CLK

B1

OEAB

CLKAB

LEAB

LEBA

CLKBA

OEBA

A1

1

55

2

28

30

27

3

54

To 17 Other Channels

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†

Supply voltage range, VCC

–0.5 V to 4.6 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input voltage range, VI (see Note 1)

–0.5 V to 7 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Voltage range applied to any output in the high state or power-off state, VO (see Note 1)

–0.5 V to 7 V

. . . .

Current into any output in the low state, IO: SN54LVT16500

96 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

SN74LVT16500

128 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Current into any output in the high state, IO (see Note 2): SN54LVT16500

48 mA

. . . . . . . . . . . . . . . . . . . . . . .

SN74LVT16500

64 mA

. . . . . . . . . . . . . . . . . . . . . . .

Input clamp current, IIK (VI < 0)

–50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Output clamp current, IOK (VO < 0)

–50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Maximum power dissipation at TA = 55°C (in still air) (see Note 3): DGG package

1 W

. . . . . . . . . . . . . . . . . . .

DL package

1.4 W

. . . . . . . . . . . . . . . . . . .

Storage temperature range, Tstg

–65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES:

1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

2. This current flows only when the output is in the high state and VO > VCC.

3. The maximum package power dissipation is calculated using a junction temperature of 150

°C and a board trace length of 750 mils.

For more information, refer to the

Package Thermal Considerations application note in the ABT Advanced BiCMOS Technology Data

Book.

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