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SMP75-8 Arkusz danych(PDF) 7 Page - STMicroelectronics |
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SMP75-8 Arkusz danych(HTML) 7 Page - STMicroelectronics |
7 / 8 page SMP75-8 7/8 Figure 13: SMB Package Mechanical data Figure 14: Foot Print Dimensions (in millimeters) In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 6: Ordering Information Table 7: Revision History Part Number Marking Package Weight Base qty Delivery mode SMP75-8 L08 SMB 0.11 g 2500 Tape & reel Date Revision Description of Changes 19-July-2005 3 Previous issue 02-Jan-2006 4 Added ECOPACK statement and changed page layout. Minor updates to technical values in Tables 2, 3, and 5. E C L E1 D A1 A2 b REF. DIMENSIONS Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.41 0.006 0.016 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 D 3.30 3.95 0.130 0.156 L 0.75 1.60 0.030 0.063 1.52 2.75 2.3 1.52 |
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