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ADS5482IRGCT Arkusz danych(PDF) 3 Page - Texas Instruments |
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ADS5482IRGCT Arkusz danych(HTML) 3 Page - Texas Instruments |
3 / 35 page ABSOLUTE MAXIMUM RATINGS (1) THERMAL CHARACTERISTICS (1) ADS5481 ADS5482, ADS5483 www.ti.com ...................................................................................................................................................................................................... SLAS565 – JUNE 2008 Over operating free-air temperature range, unless otherwise noted. ADS5481, ADS5482, ADS5483 UNIT AVDD5 to GND 6 V Supply voltage AVDD3 to GND 5 V DVDD3 to GND 5 V Analog input to Valid when AVDD5 is within normal operating range. When AVDD5 is –0.3 to (AVDD5 + 0.3) V GND off, analog inputs should be <0.5V. If not, the protection diode between the inputs and AVDD5 will become forward-biased and could be damaged or shorten device lifetime (see Figure 32). Short transient conditions during power on/off are not a concern. Clock input to GND Valid when AVDD3 is within normal operating range. When AVDD3 is –0.3 to (AVDD3 + 0.3) V off, clock inputs should be <0.5V. If not, the protection diode between the inputs and AVDD3 will become forward-biased and could be damaged or shorten device lifetime (see Figure 39). Short transient conditions during power on/off are not a concern. CLKP to CLKM ±2.5 V Digital data output to GND –0.3 to (DVDD3 + 0.3) V Digital data output Plus-to-Minus ±1 V Operating temperature range –40 to +85 °C Maximum junction temperature +150 °C Storage temperature range –65 to +150 °C ESD, human-body model (HBM) 2 kV (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. Kirkendall voidings and current density information for calculation of expected lifetime are available upon request. PARAMETER TEST CONDITIONS TYP UNIT Soldered thermal pad, no airflow 20 RθJA Soldered thermal pad, 150-LFM airflow 16 °C/W RθJC thermal resistance from the junction to the package case (top) 7 RθJP thermal resistance from the junction to the thermal pad (bottom) 0.2 (1) Using 49 thermal vias ( 7 × 7 array). See PowerPAD Package in the Application Information section. Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s): ADS5481 ADS5482, ADS5483 |
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