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ADS5482IRGCT Arkusz danych(PDF) 3 Page - Texas Instruments

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Numer części ADS5482IRGCT
Szczegółowy opis  16-Bit, 80/105/135-MSPS Analog-to-Digital Converters
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Producent  TI [Texas Instruments]
Strona internetowa  http://www.ti.com
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ADS5482IRGCT Arkusz danych(HTML) 3 Page - Texas Instruments

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ABSOLUTE MAXIMUM RATINGS
(1)
THERMAL CHARACTERISTICS
(1)
ADS5481
ADS5482, ADS5483
www.ti.com ...................................................................................................................................................................................................... SLAS565 – JUNE 2008
Over operating free-air temperature range, unless otherwise noted.
ADS5481, ADS5482, ADS5483
UNIT
AVDD5 to GND
6
V
Supply voltage
AVDD3 to GND
5
V
DVDD3 to GND
5
V
Analog input to
Valid when AVDD5 is within normal operating range. When AVDD5 is
–0.3 to (AVDD5 + 0.3)
V
GND
off, analog inputs should be <0.5V. If not, the protection diode between
the inputs and AVDD5 will become forward-biased and could be
damaged or shorten device lifetime (see Figure 32). Short transient
conditions during power on/off are not a concern.
Clock input to GND Valid when AVDD3 is within normal operating range. When AVDD3 is
–0.3 to (AVDD3 + 0.3)
V
off, clock inputs should be <0.5V. If not, the protection diode between the
inputs and AVDD3 will become forward-biased and could be damaged or
shorten device lifetime (see Figure 39). Short transient conditions during
power on/off are not a concern.
CLKP to CLKM
±2.5
V
Digital data output to GND
–0.3 to (DVDD3 + 0.3)
V
Digital data output Plus-to-Minus
±1
V
Operating temperature range
–40 to +85
°C
Maximum junction temperature
+150
°C
Storage temperature range
–65 to +150
°C
ESD, human-body model (HBM)
2
kV
(1)
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied. Kirkendall voidings and current density information for calculation of expected lifetime are available upon
request.
PARAMETER
TEST CONDITIONS
TYP
UNIT
Soldered thermal pad, no airflow
20
RθJA
Soldered thermal pad, 150-LFM airflow
16
°C/W
RθJC
thermal resistance from the junction to the package case (top)
7
RθJP
thermal resistance from the junction to the thermal pad (bottom)
0.2
(1)
Using 49 thermal vias ( 7 × 7 array). See PowerPAD Package in the Application Information section.
Copyright © 2008, Texas Instruments Incorporated
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Product Folder Link(s): ADS5481 ADS5482, ADS5483


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